Abstract
Owing to the increasing core frequency and chip integration and the limited die dimension, the power densities in CPU chip have been increasing fastly. The high temperature on chip resulted by power densities threats the processor’s performance and chip’s reliability. This paper analyzed the thermal hotspots in die and their properties. A new architecture of function units in die -— hot units distributed architecture is suggested to cope with the problems of high power densities for future processor chip.
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© 2011 Springer-Verlag Berlin Heidelberg
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Wang, J., Hu, Fy. (2011). Thermal Hotspots in CPU Die and It’s Future Architecture. In: Chen, R. (eds) Intelligent Computing and Information Science. ICICIS 2011. Communications in Computer and Information Science, vol 134. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18129-0_29
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DOI: https://doi.org/10.1007/978-3-642-18129-0_29
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-18128-3
Online ISBN: 978-3-642-18129-0
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