Abstract
In this work, we use a controlled oxidation of a mesoporous silicon substrate as a tool for extending and adjusting the Si lattice parameter to other materials such as SixGe1-x. Our approach involves four steps. First, a seed film is epitaxially grown on a single-crystal Si(100) wafer by Molecular Beam Epitaxy(MBE). Second, porosification is performed according to a standard electrochemical etching procedure but using a “two wafers technique”. Third, the porous part of the sample is oxidized at mild temperatures (300–500°C) in a dry O2 atmosphere, inducing a substantial in-plane expansion of the seed film. Fourth, an overgrowth by MBE of an epilayer is done to test the thus-obtained pseudosubstrate. The challenging task in this last step is to deoxidize the seed film surface at ~900°C without losing the strain induced by oxidation of the porous part of the sample.
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Acknowledgments
We would like to acknowledge the French Research Agency (ANR) for funding this work via a “Projet Blanc” N° BLAN06-1_144612.
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Blanchard, N.P. et al. (2011). Engineering Pseudosubstrates with Porous Silicon Technology. In: Nazarov, A., Colinge, JP., Balestra, F., Raskin, JP., Gamiz, F., Lysenko, V. (eds) Semiconductor-On-Insulator Materials for Nanoelectronics Applications. Engineering Materials. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-15868-1_3
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