Skip to main content

Implementation of the Pattern Matching System to Detect Flip Chip PCB Defects

  • Conference paper
  • 1438 Accesses

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 93))

Abstract

FPGA-based Pattern Matching System, which supports a Camera Link (Medium), was used to detect Flip Chip PCB defect patterns. For the automation of the vision inspection of the Flip Chip PCB production process, the system was optimized by implementing the vision library in IP, which is used to produce high speed processing FPGA-based systems and to detect defect patterns. The implemented IPs comprised of Pattern Matching IP, VGA Control IP, Memory Control IP and Parallel Processing MAD Pattern Matching IP. Xilinx was used to process the image transmitted in high speed from Digital Camera, Vertex-4 type 1.6 million gate FPGA chip. It allowed the processing of 4Tap (2352(H) * 1728(V) *8Bit) image data transmitted from the camera without the need for a separate Frame Grabber Board[5] in the FPGA. In addition, it could check the 1Tap(588(H) * 1728(V) *8bit) image data on a PC via USB transmission out of 4 Taps. For pattern matching, it abstracted a 256*256 area out of the 1Tap image, transmitted the image to each IP and displayed the Pattern Matching output result on a 7inch TFT-LCD.

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   84.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Yoo, J.Y.: A Study on Optimal Design of Flip-chip Inosculation Equipment. Korea Society of Machine Tool Engineers (2007)

    Google Scholar 

  2. Lee, S.Y.: A Study on the Enhancement of Flip-chip Package Reliability. Korea Society of Machine Tool Engineers (2007)

    Google Scholar 

  3. Gang, D.J.: Digital Image Processing Using Visual C++. SciTech Media (2005)

    Google Scholar 

  4. Hwang, S.Y.: Image Processing Programming Visual C++. Hanbit Media Inc. (2007)

    Google Scholar 

  5. Matrox: Solios XCL Image Frame Grabber Board Manual (2006)

    Google Scholar 

  6. Xilinx: Virtex 4 XC4VLX200 Technical Reference Manual (2007)

    Google Scholar 

  7. Lee, Y.A.: Real-time PCB Vision Test Using Pattern Matching. The Institute of Electronics Engineering of Korea Research Development Journal (2003)

    Google Scholar 

  8. Kim, S.O.: SoC System-based Real Time Moving Object Tracing System Implementation (2007)

    Google Scholar 

  9. Jang, D.Y.: Embedded SoC System to Trace Moving Object and Calculate the Distance (2006)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2010 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Moon, CH., Jang, HC., Jun, JK. (2010). Implementation of the Pattern Matching System to Detect Flip Chip PCB Defects. In: Huang, DS., McGinnity, M., Heutte, L., Zhang, XP. (eds) Advanced Intelligent Computing Theories and Applications. ICIC 2010. Communications in Computer and Information Science, vol 93. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-14831-6_37

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-14831-6_37

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-14830-9

  • Online ISBN: 978-3-642-14831-6

  • eBook Packages: Computer ScienceComputer Science (R0)

Publish with us

Policies and ethics