Abstract
Adhesive bonding is gaining importance as a key technology for precision engineering and microsystem technology. New packaging and bonding processes for microsystems frequently use bonding methods requiring adhesives with suitable properties. Permanently increasing specifications for micro assembly processes limit the use of conventional liquid adhesives. In contrast, hot melt adhesives (HMA) offer reproducible dosage sizes in a subnanoliter range. The extremely short setting times of HMAs allow to cut process time. Hybrid bonding systems combining hot melts with e.g. epoxies provide faster process times, higher performance and thermal stability of the joints. Focus of this paper is to present basics and methodology of a joining technology offering good initial strength, shorter setting times and batchwise pre-application of minimal adhesives volumes to join even miniscule bond surfaces.
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Hemken, G., Böhm, S., Dilger, K. (2011). Use of Hot Melt Adhesives for the Assembly of Microsystems. In: Büttgenbach, S., Burisch, A., Hesselbach, J. (eds) Design and Manufacturing of Active Microsystems. Microtechnology and MEMS. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-12903-2_18
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DOI: https://doi.org/10.1007/978-3-642-12903-2_18
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