Abstract
In this work we address the well-posedness of the steady-state and transient problems stemming from the coupling of a network of lumped electric elements and a PDE model of heat diffusion in the chip substrate. In particular we consider the thermal element model presented in [1] and we prove that it can be controlled by any combination of voltage sources (imposing the average current in a region of the chip) and current sources (imposing the Joule power per unit area produced in a region) connected to its temperature nodes. This result justifies the implementation of the element as a linear n-port conductance as carried out in [2].
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References
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Alì, G., Bartel, A., Culpo, M., de Falco, C. (2010). Analysis of a PDE Thermal Element Model for Electrothermal Circuit Simulation. In: Roos, J., Costa, L. (eds) Scientific Computing in Electrical Engineering SCEE 2008. Mathematics in Industry(), vol 14. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-12294-1_35
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DOI: https://doi.org/10.1007/978-3-642-12294-1_35
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