Abstract
This chapter will give a survey on the problems and the challenges related to the necessity to automatize the fiber array pigtailing and the laser integration in relation to silicon photonic devices. In fact the only way to make silicon photonics technology really exploitable at industrial level is to solve the manufacturing bottlenecks that nowadays limit the applicability of the technology, in particular related to the multiple optical outputs pluggability and the laser integration.It will start giving some detailed information on what have been developed so far in terms of state-of-the-art pigtailing-automated benches, robotics and their present limitation, making consideration on what will be necessary in the near future.It will then give a survey and an evaluation, respect to automation, on some of the most recent and interesting developments for silicon photonic packaging, in particular for the optical fiber coupling and the future desired pluggable solutions.
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References
D. Taillaert, F. Van Laere, M. Ayre, W. Bogaerts, D. Van Thourhout, P. Bienstman, R. Baets, Grating couplers for coupling between optical fibers and nanophotonic waveguides. Japan. J. Appl. Phys. (invited) 45(8A), 6071–6077 (2006)
L. Zimmermann, T. Tekin, H. Schroeder, P. Dumon, W. Bogaerts, How to bring nanophotonics to application—silicon photonics packaging, IEEE LEOS Newsletter, December 2008
GB Preve, L. Zimmermann, T. Tekin, T. Roslin, K. Landles, Packaging and assembly for integrated photonics—a review of the ePIXpack photonics packaging platform, in IEEE JSTQE 2010
P. De Dobbelaere, Light source approach for silicon photonics transceivers, in Workshop ECOC Cannes 2014
T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, P. Fortier, Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips, in IEEE 64th ECTC 2014 Orlando, FL
T. Barwicz, Y. Taira, Low-cost interfacing of fibers to nanophotonic waveguides: design for fabrication and assembly tolerances. IEEE Photonic J. 6(4) (2014)
E. Mohammed, R. Tsenga, B. Rawlingsb, S. Liffb, I. Bana, W. McFarlanea M. Reshotkoa, P. Changa, Efficient and scalable single mode waveguide coupling on silicon based substrates, Photonics West San Francisco 2014, SPIE Proc. Vol 8991
R. Houbertz, S. Steenhusen, T. Stichel, G. Sextl, Two-Photon polymerization of inorganic-organic hybrid polymers as scalable technology using ultra-short laser pulses, Chapter 25 book “Coherence and Utrashort Pulse Laser Emission”, pp. 583–608, INTECH edition 2010
R. Houbertz, H. Wolter, P. Dannberg, J. Serbin, S. Uhlig, Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing, in Proceedings of SPIE 6126, 612605.1-612605.13 (2006). doi:10.1117/12.660140
N. Lindenmann, S. Dottermusch, M.L. Goedecke, T. Hoose, M.R. Billah, T. Onanuga, A. Hofmann, W. Freude, C. Koos, Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding. J. Lightwave Technol. 33, 755–760 (2014)
N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, C. Koos, Photonic wire bonding: a novel concept for chip-scale interconnects. Opt. Express 20, 17667–17677 (2012)
D. Childers, M. Hughes, T. Satake, New, single-mode, multi-fiber, expanded beam, passive optical interconnect, Photonics West San Francisco 2014, Proceedings of SPIE, vol. 8991
K. Hiramoto, T. Takemoto, K. Adachi, Multichannel 1.3-um Lens-Integrated Surface- Emitting DFB Laser (LISEL) Arrays for High-speed Optical Interconnects at 100Gbps and beyond, in ECOC 2013 Workshop WS4—Technologies for Short Reach Optical Interconnects
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Preve, G.B. (2016). Silicon Photonics Packaging Automation: Problems, Challenges, and Considerations. In: Pavesi, L., Lockwood, D. (eds) Silicon Photonics III. Topics in Applied Physics, vol 122. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-10503-6_8
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DOI: https://doi.org/10.1007/978-3-642-10503-6_8
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