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Silicon Photonics III pp 489–516Cite as

VLSI Photonics for High-Performance Data Centers

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Part of the book series: Topics in Applied Physics ((TAP,volume 122))

Abstract

After over four decades of technology development and commercial application, photonics proves to be the best information carrier for long-haul communications. A huge effort has been taking and is still increasing to miniaturize such a photonic communication system to serve the same purpose when conventional metal interconnect in CMOS comes to its physics and practical limit. Along the road to siliconize photonics up to a much larger scale in order to design, fabricate, and test photonic links based on advanced CMOS technology, new architectures and device geometries are created and explored. In this chapter, we reviewed the development in architecture design, CMOS transceivers, and hybrid III–V-on-Si transceivers, particularly progress in HP, to unfold a technology roadmap of VLSI photonics application for data center from an industrial perspective.

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Authors and Affiliations

  1. Large-Scale Integrated Photonics Group, HP Labs, Palo Alto, USA

    Di Liang, Marco Fiorentino & Raymond G. Beausoleil

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  1. Di Liang
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  2. Marco Fiorentino
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  3. Raymond G. Beausoleil
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Correspondence to Di Liang .

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  1. Nanoscience Laboratory, University of Trento, Department of Physics, Povo, Italy

    Lorenzo Pavesi

  2. Measurement Science and Standards, National Research Council of Canada, Ottawa, Ontario, Canada

    David J. Lockwood

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Liang, D., Fiorentino, M., Beausoleil, R.G. (2016). VLSI Photonics for High-Performance Data Centers. In: Pavesi, L., Lockwood, D. (eds) Silicon Photonics III. Topics in Applied Physics, vol 122. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-10503-6_18

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