Abstract
After 15 years of research, silicon photonics has now reached a sufficient level of maturity at the device level to be implemented into low-cost optical communication products. In this chapter we review the challenges of the industrialization of silicon photonics in 300 mm facilities, using mainstream CMOS methodologies. We first review the challenges of a sustainable electronic and photonic integration allowing the production of low-cost chips for the current 100G generation but also for the future 400G and beyond. Next, the industrial testing strategy and the design of test circuits allowing an efficient process monitoring are discussed. The industrial process integration scheme of optical components on 300 mm wafers is then described, followed by the device model strategy, which is a key element in order to make the link between the photonic design kit and the process. Finally, further R&D efforts in 300 mm allowing new functionality for the longer term Si photonics development are discussed. As examples, the integration of several Si etching levels, the demonstration of smart SOI substrates feasibility for improved coupling efficiency, and integration of ring modulator are detailed.
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References
Cisco, “Cisco Global Cloud Index: Forecast and Methodology, 2012–2017.” White Paper
“Google Datacenter.”
“The Facebook Datacenter FAQ.”
A.V. Krishnamoorthy, K.W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, J.E. Cunningham, Progress in low-power switched optical interconnects. IEEE J. Sel. Top. Quantum Electron. 17(2), 357–376 (2011)
F. Boeuf, F. Arnaud, Défis et Méthodologie du Développement des technologies CMOS Avancées, in La Micro-Nanoélectronique : Enjeux et Mutations, CNRS Editions, pp. 45–64
L. Zimmermann, D. Knoll, M. Kroh, S. Lischke, D. Petousi, G. Winzer, Y. Yamamoto, “BiCMOS Silicon Photonics Platform,” presented at the OFC 2015, Los Angeles, p. Th4E.5
D.J. Shin, K.S. Cho, H. Ji, B.S. Lee, S.G. Kim, J.K. Bok, S.H. Choi, Y.H. Shin, J.H. Kim, S.Y. Lee, K.Y. Cho, B.J. Kuh, J.H. Shin, J.S. Lim, J.M. Kim, H.M. Choi, K.H. Ha, Y.D. Park, C.H. Chung, Integration of silicon photonics into DRAM process, in Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013, 2013, pp. 1–3
R. Meade, J.S. Orcutt, K. Mehta, O. Tehar-Zahav, D. Miller, M. Georgas, B. Moss, C. Sun, Y.-H. Chen, J. Shainline, M. Wade, R. Bafrali, Z. Sternberg, G. Machavariani, G. Sandhu, M. Popovic, R. Ram, V. Stojanovic, Integration of silicon photonics in bulk CMOS, in 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014, pp. 1–2
A. Huang, C. Gunn, G.-L. Li, Y. Liang, S. Mirsaidi, A. Narasimha, T. Pinguet, A 10 Gb/s photonic modulator and WDM MUX/DEMUX integrated with electronics in 0.13/spl mu/m SOI CMOS, in Solid-State Circuits Conference, 2006. ISSCC 2006. Digest of Technical Papers. IEEE International, 2006, pp. 922–929
S. Assefa, S. Shank, W. Green, M. Khater, E. Kiewra, C. Reinholm, S. Kamlapurkar, A. Rylyakov, C. Schow, F. Horst, H. Pan, T. Topuria, P. Rice, D.M. Gill, J. Rosenberg, T. Barwicz, M. Yang, J. Proesel, J. Hofrichter, B. Offrein, X. Gu, W. Haensch, J. Ellis-Monaghan, Y. Vlasov, A 90 nm CMOS integrated nano-photonics technology for 25Gbps WDM optical communications applications, in Electron Devices Meeting (IEDM), 2012 IEEE International, 2012, pp. 33.8.1–33.8.3
C. Kopp, S. Bernabé, B.B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, T. Tekin, Silicon photonic circuits: on-CMOS integration, fiber optical coupling, and packaging. IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011)
A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, P. De Dobbelaere, A grating-coupler-enabled CMOS photonics platform. IEEE J. Sel. Top. Quantum Electron. 17(3), 597–608 (2011)
L. Verslegers, A. Mekis, T. Pinguet, Y. Chi, G. Masini, P. Sun, A. Ayazi, K. Y. Hon, S. Sahni, S. Gloeckner, C. Baudot, F. Boeuf, P. De Dobbelaere, Silicon photonics device libraries for high-speed transceivers, in Photonics Conference (IPC), 2014 IEEE, 2014, pp. 65–66
S. Joblot, A. Farcy, N. Hotellier, A. Jouve, F. de Crecy, A. Garnier, M. Argoud, C. Ferrandon, J.P. Colonna, R. Franiatte, C. Laviron, S. Cheramy, Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration, in 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, pp. 1–7
F. Boeuf, S. Cremer, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, L. Verslegers, P. Sun, A. Ayazi, N.-K. Hon, S. Sahni, Y. Chi, B. Orlando, D. Ristoiu, A. Farcy, F. Leverd, L. Broussous, D. Pelissier-Tanon, C. Richard, L. Pinzelli, R. Beneyton, O. Gourhant, E. Gourvest, Y. Le-Friec, D. Monnier, P. Brun, M. Guillermet, D. Benoit, K. Haxaire, J.R. Manouvrier, S. Jan, H. Petiton, J.F. Carpentier, T. Quemerais, C. Durand, D. Gloria, M. Fourel, F. Battegay, Y. Sanchez, E. Batail, F. Baron, P. Delpech, L. Salager, P. De Dobbelaere, B. Sautreuil, A multi-wavelength 3D-compatible silicon photonics platform on 300 mm SOI wafers for 25 Gb/s applications, in Electron Devices Meeting (IEDM), 2013 IEEE International, 2013, pp. 13.3.1–13.3.4
S.K. Selvaraja, E. Rosseel, L. Fernandez, M. Tabat, W. Bogaerts, J. Hautala, P. Absil, SOI thickness uniformity improvement using corrective etching for silicon nano-photonic device, in 8th IEEE International Conference on Group IV Photonics (GFP), 2011, 2011, pp. 71–73
M.T. Currie, S.B. Savamedam, T.A Langdo, C.W. Leitz, E.A. Fitzgerald, Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing. Appl. Phys. Lett. 1718–1720 (1998)
OZOPTICS
Y. Yang, M. Yu, S. Member, Q. Fang, J. Song, L. Ding, G. Lo, Through-Si-via (TSV) Keep-Out-Zone (KOZ) in SOI photonics interposer : a study of the impact of TSV-induced stress on si ring resonators in SOI photonics interposer : a study of the impact of TSV-induced stress on si ring resonators. IEEE Photonics J. 5(6) (2013)
G.T. Reed, G.Z. Mashanovich, F.Y. Gardes, M. Nedeljkovic, Y. Hu, D.J. Thomson, K. Li, P.R. Wilson, S. Chen, S.S. Hsu, Recent breakthroughs in carrier depletion based silicon optical modulators. Nanophotonics 3(4), 229–245 (2013)
G. Li, T.G. Masson, P.K. Yu, Analysis of segmented traveling-wave optical modulators. J. Light. Technol. 22(7), 1789–1796 (2004)
M. Cignoli, G. Minoia, M. Repossi, D. Baldi, A. Ghilioni, E. Temporiti, F. Svelto, A 1310 nm 3D-Integrated Silicon Photonics Mach-Zehnder-Based Transmitter with 275mW Multistage CMOS Driver Achieving 6 dB Extinction Ratio at 25 Gb/s, in IEEE International Solid-State Circuits Conference, 2015, pp. 416–418
Datasheet SHF 806E, 2015
T. Baehr-jones, R. Ding, Y. Liu, A. Ayazi, T. Pinguet, C. Nicholas, M. Streshinsky, P. Lee, Y. Zhang, A.E. Lim, S.H. Teo, G. Lo, M. Hochberg, Ultralow drive voltage silicon traveling-wave modulator. Opt. Exp. 20(11), 12014–12020 (2012)
M. Streshinsky, R. Ding, A. Novack, Y. Liu, X. Tu, A.E. Lim, E. Koh Sing Chen, P. Guo-Qiang Lo, T. Baehr-Jones, M. Hochberg, 50 Gb/s Silicon Traveling Wave Mach-Zehnder Modulator near 1300 nm, in Optical Fiber Communication Conference, 2014
E. Temporiti, G. Minoia, M. Repossi, D. Baldi, A. Ghilioni, F. Svelto, A 3D-integrated 25Gbps silicon photonics receiver in PIC25G and 65 nm CMOS technologies, in European Solid State Circuits Conference (ESSCIRC), ESSCIRC 2014–40th, 2014, pp. 131–134
InfinityQuadeTM Multi-contact probe
P. De Dobbelaere, Silicon Photonics Technology Platform for High Speed Interconnect, in Semicon West, 2013
G. Denoyer, C. Cole, A. Santipo, R. Russo, C. Robinson, L. Li, Y. Zhou, J.A. Chen, B. Park, F. Boeuf, S. Cremer, N. Vulliet, Hybrid silicon photonic circuits and transceiver for 50 Gb/s NRZ transmission over single-mode fiber. Light. Technol. J. 33(6), 1247–1254 (2015)
W.S. Zaoui, A. Kunze, W. Vogel, M. Berroth, CMOS-compatible polarization splitting grating couplers with a backside metal mirror. IEEE Photonics Technol. Lett. 25(14), 1395–1397 (2013)
P. De Dobbelaere, S. Abdalla, S. Gloeckner, M. Mack, G. Masini, A. Mekis, T. Pinguet, S. Sahni, D. Guckenberger, M. Harrison, A. Narasimha, Si photonics based high-speed optical transceivers, in 2012 38th European Conference and Exhibition on Optical Communications (ECOC), 16–20 Sept. 2012, 2012, p. 3
C. Zhang, J.-H. Sun, X. Xiao, W.-M. Sun, X.-J. Zhang, T. Chu, J.-Z. Yu, Y.-D. Yu, High efficiency grating coupler for coupling between single-mode fiber and SOI waveguides. Chin. Phys. Lett. 30(1), 014207 (2013)
X. Chen, C. Li, C.K.Y. Fung, S.M.G. Lo, H.K. Tsang, apodized waveguide grating couplers for efficient coupling to optical fibers. IEEE Photonics Technol. Lett. 22(15), 1156–1158 (2010)
X. Chen, H.K. Tsang, Engineering of silicon-on-insulator waveguide gratings for coupling to optical fibers, in Opto-Electronics and Communications Conference (OECC), 2011 16th, 2011, pp. 845–846
C. Li, H. Zhang, M. Yu, G.Q. Lo, CMOS-compatible high efficiency double-etched apodized waveguide grating coupler. Opt. Exp. 21(7), 7868 (2013)
Z. Wang, Y. Tang, L. Wosinski, High efficiency grating couplers for silicon-on-insulator photonic circuits, in 2010 36th European Conference and Exhibition on Optical Communication (ECOC), 2010, pp. 1–3
W.S. Zaoui, M.F. Rosa, W. Vogel, M. Berroth, J. Butschke, F. Letzkus, Cost-effective CMOS-compatible grating couplers with backside metal mirror and 69 % coupling efficiency. Opt. Exp. 20(26), B238 (2012)
D. Vermeulen, S. Selvaraja, P. Verheyen, G. Lepage, W. Bogaerts, P. Absil, D. Van Thourhout, G. Roelkens, High-efficiency fiber-to-chip grating couplers realized using an advanced CMOS-compatible silicon-on-insulator platform. Opt. Exp. 18(17), 18278 (2010)
F. Van Laere, W. Bogaerts, P. Dumon, G. Roelkens, D. Van Thourhout, R. Baets, Focusing polarization diversity grating couplers in silicon-on-insulator. J. Light. Technol. 27(5), 612–618 (2009)
S.K. Selvaraja, D. Vermeulen, M. Schaekers, E. Sleeckx, W. Bogaerts, G. Roelkens, P. Dumon, D. Van Thourhout, R. Baets, Highly efficient grating coupler between optical fiber and silicon photonic circuit, in Conference on Lasers and Electro-Optics, 2009 and 2009 Conference on Quantum electronics and Laser Science Conference. CLEO/QELS 2009, 2009, pp. 1–2
C. Kopp, E. Augendre, R. Orobtchouk, O. Lemonnier, J.-M. Fedeli, Enhanced fiber grating coupler integrated by wafer-to-wafer bonding. J. Light. Technol. 29(12), 1847–1851 (2011)
F. Van Laere, G. Roelkens, M. Ayre, J. Schrauwen, D. Taillaert, D. Van Thourhout, T.F. Krauss, R. Baets, Compact and highly efficient grating couplers between optical fiber and nanophotonic waveguides. J. Light. Technol. 25(1), 151–156 (2007)
G. Li, X. Zheng, H. Thacker, J. Yao, Y. Luo, I. Shubin, K. Raj, E. John, A.V. Krishnamoorthy, 40 Gb / s thermally tunable CMOS ring modulator, in Conference on Group IV Photonics, 2012, pp. 12–14
O. Dubray, S. Menezo, B. Blampey, P. Le Maitre, J.F. Carpentier, B. Ben Bakir, 20 Gb / s PAM-4 Transmission from 35 to 90 °C by modulating a Silicon Ring Resonator Modulator with 2Vpp, in Optical Fiber Communication Conference, 2015, pp. 4–6
C. Li, R. Bai, A. Shafik, E.Z. Tabasy, G. Tang, C. Ma, C.H. Chen, Z. Peng, M. Fiorentino, P. Chiang, S. Palermo, A ring-resonator-based silicon photonics transceiver with bias-based wavelength stabilization and adaptive-power-sensitivity receiver. IEEE Int. Solid-State Circuits Conf. 56, 124–125 (2013)
M. Rakowski, M. Pantouvaki, P. De Heyn, P. Verheyen, M. Ingels, H. Chen, J. De Coster, G. Lepage, B. Snyder, K. De Meyer, M. Steyaert, N. Pavarelli, J.S. Lee, P. O’Brien, P. Absil, J. Van Campenhout, A 4 × 20 Gb/s WDM Ring-Based Hybrid CMOS Silicon Photonics Transceiver, in IEEE International Solid-State Circuits Conference, 2015
J. Müller, F. Merget, S.S. Azadeh, J. Hauck, S.R. García, B. Shen, J. Witzens, Optical peaking enhancement in high-speed ring modulators. Sci. Rep. 4(6310) (2014)
D.G. Rabus, Integrated Ring Resonator, The Compendium (2007)
Y. Ma, Z. Xuan, Y. Liu, R. Ding, Y. Li, A.E. Lim, G. Lo, T. Baehr-jones, M. Hochberg, Silicon Microring Based Modulator and Filter for High Speed Transmitters at 1310 nm, in IEEE Optical Interconnect Conference, 2014, vol. MC6, pp. 23–24
J.K. Poon, W.D. Sacher, J.C. Mikkelsen, S. Assefa, D.M. Gill, T. Barwicz, H. Pan, S.M. Shank, Y. Vlasov, W.M. Green, Breaking the Conventional Limitations of Microrings, in CLEO: 2014, 2014, p. SM3G.1
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Bœuf, F., Carpentier, J.F., Baudot, C., Le Maitre, P., Manouvrier, JR. (2016). Silicon Photonics Research and Manufacturing Using a 300-mm Wafer Platform. In: Pavesi, L., Lockwood, D. (eds) Silicon Photonics III. Topics in Applied Physics, vol 122. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-10503-6_10
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DOI: https://doi.org/10.1007/978-3-642-10503-6_10
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