Abstract
One of the most serious challenges in the information industry is bandwidth bottlenecks in inter-chip interconnects. We proposed a photonics–electronics convergence system in response to this issue, demonstrated silicon optical interposers integrated with all optical components on a silicon substrate, and achieved a high bandwidth density of 30 Tbps/cm2, which is sufficient for the needs of the late 2010s.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
What is big data? http://www-01.ibm.com/software/data/bigdata/what-is-big-data.html
Intel, Facebook collaborate on future data center rack technologies, http://newsroom.intel.com/community/intel_newsroom/blog/2013/01/16/intel-facebook-collaborate-on-future-data-center-rack-technologies
ISSCC 2014 trends, http://isscc.org/doc/2014/2014_Trends.pdf
JEDEC publishes Wide I/O 2 mobile DRAM standard, http://www.jedec.org/news/pressreleases/jedec-publishes-wide-io-2-mobile-dram-standard
J. Kim, Y. Kim, HBM: memory solution for bandwidth-hungry processors. Hot chips 26 (2014), http://www.hotchips.org/wp-content/uploads/hc_archives/hc26/HC26-11-day1-epub/HC26.11-3-Technology-epub/HC26.11.310-HBM-Bandwidth-Kim-Hynix-Hot%20Chips%20HBM%202014%20v7.pdf
M. Black, Hybrid Memory Cube, in Electronic Design Process Symposium (2013), http://www.eda.org/edps/edp2013/Papers/3-3%20FINAL%20for%20Mike%20Black.pdf
International Technology Roadmap for Semiconductors 2012 Update, Overall Roadmap Technology Characteristics (ORTC) Tables, and Assembly and Packaging Tables, http://www.itrs.net/ITRS%201999-2014%20Mtgs,%20Presentations%20&%20Links/2012ITRS/Home2012.htm
1.I.A. Young, E.M. Mohammed, J.T.S. Liao, A.M. Palermo, B.A. Block, M.R. Reshotko, P.L.D. Chang, Optical technology for energy efficient I/O in high performance computing. IEEE Commun. Mag. 48, 184–191 (2010)
L. Chen, K. Preston, S. Manipatruni, M. Lipson, Integrated GHz silicon photonic interconnect with micrometer-scale modulators and detectors. Opt. Express 17, 15248–15256 (2009)
K. Raj, J.E. Cunningham, R. Ho, X. Zheng, H. Schwetman, P. Koka, M. McCracken, J. Lexau, G. Li, H. Thacker, I. Shubin, Y. Luo, J. Yao, M. Asghari, T. Pinguet, J. Mitchell, A.V. Krishnamoorthy, ’Macrochip’ computer systems enabled by silicon photonic interconnects. Proc. SPIE 7607, 1–16 (2010)
G. Kim, J.W. Park, I.G. Kim, S. Kim, S. Kim, J.M. Lee, G.S. Park, J. Joo, K.S. Jang, J.H. Oh, S.A. Kim, J.H. Kim, J.Y. Lee, J.M. Park, D.W. Kim, D.K. Jeong, M.S. Hwang, J.K. Kim, K.S. Park, H.K. Chi, H.C. Kim, D.W. Kim, M.H. Cho, Low-voltage high-performance silicon photonic devices and photonic integrated circuits operating up to 30 Gb/s. Opt. Express 19, 26936–26947 (2011)
Y. Arakawa, T. Nakamura, Y. Urino, T. Fujita, Silicon photonics for next generation system integration platform. IEEE Commun. Mag. 51, 72–77 (2013)
R.E. Camacho-Aguilera, Y. Cai, N. Patel, J.T. Bessette, M. Romagnoli, L.C. Kimerling, J. Michel, An electrically pumped germanium laser. Opt. Express 20, 11316–11320 (2012)
P.D. Dobbelaere, Light source approach for silicon photonics transceivers, in Sunday workshop in ECOC, WS1 (2014), http://www.ecoc2014.org/uploads/Workshops/WS1/ECOC2014_WS1_Peter%20De%20Dobbelaere.pdf
M.N. Sysak, H. Park, A.W. Fang, J.E. Bowers, R. Jones, O. Cohen, O. Raday, M. Paniccia, “Experimental and theoretical thermal analysis of a hybrid silicon evanescent laser. Opt. Express 15, 15041–15046 (2007)
T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, Y. Arakawa, High density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for inter-chip optical interconnection, in Proceedings of Group IV Photonics (2011), pp. 181–183
N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, Y. Arakawa, 2.2 pJ/bit operation of hybrid integrated light source on a silicon optical interposer for optical interconnection, in Proceedings of IEEE Photonic Conference (2013), pp. 254–255
Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T. Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, Y. Arakawa, First demonstration of high density optical interconnects integrated with lasers, optical modulators and photodetectors on single silicon substrate. Opt. Express 19, B159–B165 (2011)
N. Hirayama, H. Takahashi, Y. Noguchi, M. Yamagishi, T. Horikawa, Low-loss Si waveguides with variable-shaped-beam EB lithography for large-scaled photonic circuits, in Extended Abstract Solid State Devices and Materials (2012), pp. 530–531
T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, Y. Arakawa, Multichannel and high-density hybrid integrated light source with a laser diode array on a silicon optical waveguide platform for interchip optical interconnection. Photon. Res. 2, A19–A24 (2014)
N. Hatori, T. Shimizu, M. Okano, M. Ishizaka, T. Yamamoto, Y. Urino, M. Mori, T. Nakamura, Y. Arakawa, A hybrid integrated light source on a silicon platform using a trident spot-size converter. J. Lightwave Technol. 32, 1329–1336 (2014)
T. Shimizu, M. Ishizaka, N. Hatori, M. Okano, T. Yamamoto, M. Mori, Y. Urino, T. Nakamura, Y. Arakawa, Multi-channel hybrid integrated light source for ultra-high-bandwidth optical interconnections and its structural optimization for low power consumption by considering thermal interference between LD array. Trans. Jpn. Inst. Elect. Pack. 7, 94–103 (2014)
L. Liao, A. Liu, D. Rubin, J. Basak, Y. Chetrit, H. Nguyen, R. Cohen, N. Izhaky, M. Paniccia, 40 Gbit/s silicon optical modulator for high speed applications. Electron. Lett. 43, 1196–1197 (2007)
D.J. Thomson, F.Y. Gardes, Y. Hu, G. Mashanovich, M. Fournier, P. Grosse, J.-M. Fedeli, G.T. Reed, High contrast 40 Gb/s optical modulation in silicon. Opt. Express 19, 11507–11516 (2011)
P. Dong, L. Chen, Y.-K. Chen, High-speed low-voltage single-drive push-pull silicon Mach-Zehnder modulators. Opt. Express 20, 6163–6169 (2012)
S. Akiyama, T. Baba, M. Imai, T. Akagawa, M. Takahashi, N. Hirayama, H. Takahashi, Y. Noguchi, H. Okayama, T. Horikawa, T. Usuki, 12.5-Gb/s operation with 0.29-V•cm VπL using silicon Mach-Zehnder modulator based-on forward-biased pin diode. Opt. Express 20, 2911–2923 (2012)
J. Fujikata, M. Miura, M. Noguchi, D. Okamoto, T. Horikawa, Y. Arakawa, Si waveguide-integrated metal–semiconductor–metal and p–i–n-type Ge photodiodes using Si-capping layer. Jpn. J. Appl. Phys. 52, 04CG10 (2013)
Y. Urino, T. Usuki, J. Fujikata, M. Ishizaka, K. Yamada, T. Horikawa, T. Nakamura, Y. Arakawa, High-density and wide-bandwidth optical interconnects with silicon optical interposers. Photon. Res. 2, A1–A7 (2014)
Y. Arakawa, H. Sakaki, Multidimensional quantum well laser and temperature dependence of its threshold current. Appl. Phys. Lett. 40, 939–941 (1982)
A. Lee, Q. Jiang, M. Tang, A. Seeds, H. Liu, Continuous-wave InAs/GaAs quantum-dot laser diodes monolithically grown on Si substrate with low threshold current densities. Opt. Express 20, 22181–22187 (2012)
A.Y. Liu, C. Zhang, J. Norman, A. Snyder, D. Lubyshev, J.M. Fastenau, A.W.K. Liu, A.C. Gossard, J.E. Bowers, High performance continuous wave 1.3 μm quantum dot lasers on silicon. Appl. Phys. Lett. 104, 041104-1–-4 (2014)
K. Tanabe, T. Rae, K. Watanabe, Y. Arakawa, High-temperature 1.3Â ÎĽm InAs/GaAs quantum dot lasers on Si substrates fabricated by wafer bonding. Appl. Phys. Express 6, 082703-1-4 (2013)
T. Baba, S. Akiyama, M. Imai, N. Hirayama, H. Takahashi, Y. Noguchi, T. Horikawa, T. Usuki, 50-Gb/s ring-resonator-based silicon modulator. Opt. Express 21, 11869–11876 (2013)
K. Padmaraju, D.F. Logan, T. Shiraishi, J.J. Ackert, A.P. Knights, K. Bergman, Wavelength locking and thermally stabilizing microring resonators using dithering signals. J. Lightwave Technol. 32, 505–515 (2014)
X. Zheng, E. Chang, P. Amberg, I. Shubin, J. Lexau, F. Liu, H. Thacker, S.S. Djordjevic, S. Lin, Y. Luo, J. Yao, J.H. Lee, K. Raj, R. Ho, J.E. Cunningham, A.V. Krishnamoorthy, A high-speed, tunable silicon photonic ring modulator integrated with ultra-efficient active wavelength control. Opt. Express 22, 12628–12633 (2014)
E. Timurdogan, C.M.S. Agaskar, J. Sun, E.S. Hosseini, A. Biberman, M.R. Watts, An ultralow power athermal silicon modulator. Nat. Commun. 5(4008), 1–11 (2014)
S. Akiyama, T. Baba, M. Imai, M. Mori, T. Usuki, High-performance silicon modulator for integrated transceivers fabricated on 300-mm wafer, in Proceedings of ECOC, P.2.8 (2014)
Y. Urino, N. Hatori, K. Mizutani, T. Usuki, J. Fujikata, K. Yamada, T. Horikawa, T. Nakamura, Y. Arakawa, First demonstration of athermal silicon optical interposers with quantum dot lasers operating up to 125 ºC. J. Lightwave Technol. 33, 1223–1229 (2015)
D. Okamoto, Y. Urino, T. Akagawa,, S. Akiyama, T. Baba, T. Usuki, M. Miura, J. Fujikata, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, H. Takahashi, Y. Noguchi, M. Noguchi, M. Imai, M. Yamagishi, S. Saitou, N. Hirayama, M. Takahashi, E. Saito, D. Shimura, H. Okayama, Y. Onawa, H. Yaegashi, H. Nishi, H. Fukuda, K. Yamada, M. Mori, T. Horikawa, T. Nakamura, Y. Arakawa, Demonstration of 25-Gbps optical data links on silicon optical interposer using FPGA transceiver, in Proceedings of ECOC, P.2.11 (2014)
T. Shimizu, M. Okano, H. Takahashi, N. Hatori, M. Ishizaka, T. Yamamoto, M. Mori, T. Horikawa, Y. Urino, T. Nakamura, Y. Arakawa, Demonstration of over 1000-channel hybrid integrated light source for ultra-high bandwidth interchip optical interconnection, in Proceedings of OFC, Th1C.6 (2014)
S. Akiyama, T. Usuki, High-speed and efficient silicon modulator based on forward-biased pin diodes. Front. Phys. 2(65), 1–7 (2014)
H. Takahashi, M. Toyama, M. Seki, D. Shimura, K. Koshino, N. Yokoyama, M. Ohtsuka, A. Sugiyama, E. Ishitsuka, T. Sano, T. Horikawa, The impacts of ArF Excimer Immersion Lithography on Integrated Silicon Photonics Technology, in Ext. Abst. Solid State Devices and Materials (2012), pp. 528–529
H. Okayama, D. Shimura, Y. Onawa, H. Takahashi, M. Seki, K. Koshino, N. Yokoyama, M. Oshtsuka, T. Tsuchizawa, H. Nishi, K. Yamada, H. Yaegashi, T. Horikawa, H. Sasaki, Si wire array waveguide grating with stray light reduction scheme fabricated by ArF excimer immersion lithography. Electron. Lett. 49, 1401–1402 (2013)
T. Amano, S. Ukita, Y. Egashira, M. Sasaki, M. Mori, K. Kurata, A 25-Gbps operation of polymer-based optical and electrical hybrid LSI package substrate with optical card edge connector, in Proceedings of IEEE Optical interconnects conference, WB2 (2015)
K. Yashiki, Y. Suzuki, Y. Hagihara, M. Kurihara, M. Tokushima, J. Fujikata, A. Ukita, K. Takemura, T. Shimizu, D. Okamoto, J. Ushida, S. Takahashi, T. Uemura, M. Okano, J. Tsuchida, T. Nedachi, M. Fushimi, I. Ogura, J. Inasaka, K. Kurata, 5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF, in Proceedings of OFC, Th1G.1 (2015)
J. Petrilla, 100G MMF Reach Objective, in IEEE P802.3 Next Generation 100Â Gb/s Optical Ethernet Study Group Plenary Meeting (2012), http://www.ieee802.org/3/100GNGOPTX/public/mar12/plenary/petrilla_02b_0312_NG100GOPTX.pdf
J. Petrilla, 100G PSM4 Power, Size & Cost Estimates & Comparisons, in IEEE P802.3bm 40Â Gb/s and 100Â Gb/s Fiber Optic Task Force Interim Meeting (2013), http://www.ieee802.org/3/bm/public/jan13/petrilla_03a_0113_optx.pdf
H.C. Nguyen, S. Hashimoto, M. Shinkawa, T. Baba, Compact and fast photonic crystal silicon optical modulators. Opt. Express 20, 22465–22474 (2012)
A. Melikyan, L. Alloatti, A. Muslija, D. Hillerkuss, P.C. Schindler, J. Li, R. Palmer, D. Korn, S. Muehlbrandt, D. Van Thourhout, B. Chen, R. Dinu, M. Sommer, C. Koos, M. Kohl, W. Freude, J. Leuthold, High-speed plasmonic phase modulators. Nat. Photonics 8, 229–233 (2014)
Y. Kim, M. Takenaka, T. Osada, M. Hata, S. Takagi, Strain-induced enhancement of plasma dispersion effect and free-carrier absorption in SiGe optical modulators. Sci. Rep. 4, 4683 (2014)
S.J. Koester, M. Li, High-speed waveguide-coupled graphene-on-graphene optical modulators. Appl. Phys. Lett. 100, 171107 (2012)
Acknowledgments
This work was conducted by the Institute for Photonics-Electronics Convergence System Technology (PECST), supported by a grant from the Japan Society for the Promotion of Science (JSPS) through its “Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST Program)” initiated by the Council for Science and Technology Policy. Part of the fabrication was conducted at the Tsukuba Innovation Arena Super Clean Room (TIA-SCR) and Nano-Processing Facility (NPF) by AIST. The authors also acknowledge Tatsuya Usuki, Suguru Akiyama, Takeshi Akagawa, Takeshi Baba, Junichi Fujikata, Daisuke Okamoto, Makoto Miura, Masashige Ishizaka, Nobuaki Hatori, Takanori Shimizu, Makoto Okano, Tsuyoshi Yamamoto, Tsuyoshi Horikawa, Hiroyuki Takahashi, Yoshiji Noguchi, Masataka Noguchi, Masahiko Imai, Masashi Yamagishi, Shigeru Saitou, Naoki Hirayama, Masashi Takahashi, Emiko Saito, Koji Yamada, Daisuke Shimura, Hideaki Okayama, Yosuke Onawa, Hiroki Yaegashi, Hidetaka Nishi, Hiroshi Fukuda, Masahiko Mori, and Kenji Mizutani for their efforts and contributions.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2016 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Urino, Y., Nakamura, T., Arakawa, Y. (2016). Silicon Optical Interposers for High-Density Optical Interconnects. In: Pavesi, L., Lockwood, D. (eds) Silicon Photonics III. Topics in Applied Physics, vol 122. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-10503-6_1
Download citation
DOI: https://doi.org/10.1007/978-3-642-10503-6_1
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-10502-9
Online ISBN: 978-3-642-10503-6
eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)