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Silicon Optical Interposers for High-Density Optical Interconnects

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Silicon Photonics III

Part of the book series: Topics in Applied Physics ((TAP,volume 122))

Abstract

One of the most serious challenges in the information industry is bandwidth bottlenecks in inter-chip interconnects. We proposed a photonics–electronics convergence system in response to this issue, demonstrated silicon optical interposers integrated with all optical components on a silicon substrate, and achieved a high bandwidth density of 30 Tbps/cm2, which is sufficient for the needs of the late 2010s.

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Acknowledgments

This work was conducted by the Institute for Photonics-Electronics Convergence System Technology (PECST), supported by a grant from the Japan Society for the Promotion of Science (JSPS) through its “Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST Program)” initiated by the Council for Science and Technology Policy. Part of the fabrication was conducted at the Tsukuba Innovation Arena Super Clean Room (TIA-SCR) and Nano-Processing Facility (NPF) by AIST. The authors also acknowledge Tatsuya Usuki, Suguru Akiyama, Takeshi Akagawa, Takeshi Baba, Junichi Fujikata, Daisuke Okamoto, Makoto Miura, Masashige Ishizaka, Nobuaki Hatori, Takanori Shimizu, Makoto Okano, Tsuyoshi Yamamoto, Tsuyoshi Horikawa, Hiroyuki Takahashi, Yoshiji Noguchi, Masataka Noguchi, Masahiko Imai, Masashi Yamagishi, Shigeru Saitou, Naoki Hirayama, Masashi Takahashi, Emiko Saito, Koji Yamada, Daisuke Shimura, Hideaki Okayama, Yosuke Onawa, Hiroki Yaegashi, Hidetaka Nishi, Hiroshi Fukuda, Masahiko Mori, and Kenji Mizutani for their efforts and contributions.

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Urino, Y., Nakamura, T., Arakawa, Y. (2016). Silicon Optical Interposers for High-Density Optical Interconnects. In: Pavesi, L., Lockwood, D. (eds) Silicon Photonics III. Topics in Applied Physics, vol 122. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-10503-6_1

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