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Accounting for Heat Transfer Problems in the Semiconductor Industry

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Thermal Nanosystems and Nanomaterials

Part of the book series: Topics in Applied Physics ((TAP,volume 118))

Abstract

Electronics has become omnipresent in our everyday lives. Occurring in all modern machines in the form of systems, functions, and components, it is gradually supplementing or replacing those functions previously carried out exclusively by mechanics, electromechanics, hydraulics, and pneumatics, by making the processes faster, more flexible, and safer in a quite spectacular way, and enriching the interaction between human and machine, until it has become a key feature of innovation and competitivity in all sectors of the economy.

The preliminary ‘electronification’ of existing systems is quickly followed by ever more sophisticated attempts to integrate electronic components and functions as close as possible to the target information sources and the devices to be operated, positioning the information processing and storage centers (processor and memory) as judiciously as possible. In this way, all kinds of chip are taken away from the sheltered conditions of specialised containers and end up having to operate in whatever environment prevails at the heart of the system they are designed to serve. In high speed trains, the encapsulated chips of the power switches are in contact with the alternator, at temperatures that sometimes reach 300°C, while those controlling car ignition must resist humidity and corrosion, and the power transistors in radars and lasers of on-board lidar systems have to operate at high altitudes, at sea, or in the field.

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Authors and Affiliations

  1. Laboratoire Multimatériaux et Interface, Université Claude Bernard Lyon I, Bâtiment Claude Berthollet, 22 rue Gaston Berger, 69622, Villeurbanne Cedex, France

    Christian Brylinski

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  1. Christian Brylinski
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Correspondence to Christian Brylinski .

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  1. et Macroscopique, Laboratoire d'Energétique Moléculaire, Grande Voie des Vignes, Châtenay Malabry, 92295, France

    Sebastian Volz

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Brylinski, C. (2009). Accounting for Heat Transfer Problems in the Semiconductor Industry. In: Volz, S. (eds) Thermal Nanosystems and Nanomaterials. Topics in Applied Physics, vol 118. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-04258-4_12

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  • DOI: https://doi.org/10.1007/978-3-642-04258-4_12

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  • Print ISBN: 978-3-642-04257-7

  • Online ISBN: 978-3-642-04258-4

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