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Nanoscale Phenomena pp 89–101Cite as

Copper Electrodeposition from Ultrathin Layer of Electrolyte

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Part of the book series: NanoScience and Technology ((NANO))

Abstract

Electrochemical metallization of copper is used in microelectronics e.g., on-chip interconnection. The need for the fundamental understanding of the copper electrodeposition and the avoiding of ramified deposits, by exploration of especially the influence of the chemical–physical environment on the deposition, becomes more essential for the development of the microelectronic- and other related industries. Contrary to standard electrochemistry the electrodeposition from an ultrathin layer of electrolyte produces much more regular deposits, because of suppressed convection noises within this ultrathin layer. The details of the deposit morphology give information about how the copper deposition develops. It also hints at the influence of the local electric field and the local concentration filed on the morphology and the structure of copper deposits. This unique growth system may have significant implications on the pattern formation of many interfacial growth systems. Besides the use for basic scientific research, there are also perspectives for different applications in the field of parallel micro- and nano-wiring and the creation of periodical nanostructured films.

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Author information

Authors and Affiliations

  1. Institute of Nanotechnology, Forschungszentrum Karlsruhe, D-76021, Karlsruhe, Germany

    S. Zhong

  2. Chair of Particle Technology, Friedrich-Alexander-University Erlangen- Nuremberg, D-91058, Erlangen, Germany

    T. Koch

  3. National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, 210093, Nanjing, China

    M. Wang

  4. National Laboratory of Superhard Materials and Institute of Atomic and Molecular Physics, Jilin University, 130012, Changchun, China

    M. Zhang

  5. Institut für Angewandte Physik, Universität Karlsruhe, 76128, Karlsruhe, Germany

    T. Schimmel

  6. DFG-Center for Functional Nanostructure (CFN), Universität Karlsruhe, 76128, Karlsruhe, Germany

    T. Schimmel

  7. Institut für Angewandte Physik, Forschungszentrum Karlsruhe GmbH, 76021, Karlsruhe, Germany

    T. Schimmel

Authors
  1. S. Zhong
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  2. T. Koch
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  3. M. Wang
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  4. M. Zhang
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  5. T. Schimmel
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Editor information

Editors and Affiliations

  1. Institut für Nanotechnologie, Forschungszentrum Karlsruhe GmbH, Karlsruhe, 76021, Germany

    Horst Hahn

  2. Inst. Electronic Engineering &, Academy of Science of Moldova, Academiei Street 3/3, Chisinau, 2028, Moldova

    Anatoli Sidorenko

  3. Academy of Sciences of Moldova, Bd. Stefan cel Mare 1, Chisinau, 2001, Moldova

    Ion Tiginyanu

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© 2009 Springer-Verlag Berlin Heidelberg

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Zhong, S., Koch, T., Wang, M., Zhang, M., Schimmel, T. (2009). Copper Electrodeposition from Ultrathin Layer of Electrolyte. In: Hahn, H., Sidorenko, A., Tiginyanu, I. (eds) Nanoscale Phenomena. NanoScience and Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-00708-8_9

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