Abstract
Organic and inorganic semiconductors are diverse in many of their physical properties but the combination of these can feature unexpected as well as unique physical properties. Here we report on an organic/inorganic hetero-junction which can readily be utilized for sensing infrared light. The used materials are highly boron doped crystalline silicon (100) and a soluble buckminster fullerene derivative. Despite the missing light absorption of silicon as well as the of the fullerene derivative for a wavelengths beyond 1.3 μm and 720 nm respectively, a hetero-junction of these materials absorbs in the infrared and generates a primary photo-current in the wavelength range from 1.3 to 3 μm. The simple preparation of the hetero-junction by a solution process of the fullerene derivative on top of the silicon wafer substrate, is technologically attractive in an economically viable way.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
G. Konstantatos, , Nature 442, 180 (2006).
G. J. Matt, T. Fromherz, G. Goncalves, C. Lungenschmied, D. Meissner, N. S. Sariciftci, and G. Bauer, submitted (2008)
S. Suto, K. Sakamoto, and T. Wakita, Physical Review B 56, 7439 (1997).
T. R. Ohno, , Physical Rewiew B 44, 13747 (1991).
C. J. Brabec, , Advanced Functional Materials 11, 374 (2001).
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2009 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Matt, G.J., Fromherz, T., Goncalves, G., Lungenschmied, C., Meissner, D., Sariciftci, S.N. (2009). Sensing infrared light with an organic/inorganic hetero-junction. In: Al-Shamery, K., Horowitz, G., Sitter, H., Rubahn, HG. (eds) Interface Controlled Organic Thin Films. Springer Proceedings in Physics, vol 129. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-95930-4_25
Download citation
DOI: https://doi.org/10.1007/978-3-540-95930-4_25
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-95929-8
Online ISBN: 978-3-540-95930-4
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)