First we discuss the dependence of primary etch parameters (etchrate, uniformity) on independent primary parameters (pressure, gas composition…), and continue with the microfeatures which depend mainly on secondary parameters (such as electron density, ion density, electron temperature…) in all the various types of discharges, avoiding going too deeply into chemical details, which are deferred to Chap. 12. A short introduction into damage caused by physical and chemical impact concludes this chapter.
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© 2009 Springer-Verlag Berlin Heidelberg
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Franz, G. (2009). Plasma etch processes. In: Low Pressure Plasmas and Microstructuring Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-85849-2_11
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DOI: https://doi.org/10.1007/978-3-540-85849-2_11
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