Three plasma-driven deposition processes are dealt with: sputtering, chemical vapor deposition, and ion beam deposition. Sputtering consists of three subprocesses: processes which happen at the target, at the substrate, and in the plasma bulk between them. Processes at the target surface can be subsumed under etching, but are considered in this chapter.
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© 2009 Springer-Verlag Berlin Heidelberg
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Franz, G. (2009). Plasma deposition processes. In: Low Pressure Plasmas and Microstructuring Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-85849-2_10
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DOI: https://doi.org/10.1007/978-3-540-85849-2_10
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