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Mechanical Properties of Micromachined Structures

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Nanotribology and Nanomechanics

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Abstract

To be able to accurately design structures and make reliability predictions in any field, it is first necessary to know the mechanical properties of the materials that make up the structural components. The devices encountered in the fields of microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), are necessarily very small, and so the processing techniques and the microstructures of the materials used in these devices may differ significantly from bulk structures. Also, the surface-area-to-volume ratios in such structures are much higher than in bulk samples, and so surface properties become much more important. In short, it cannot be assumed that the mechanical properties measured for a bulk specimen of a material will apply when the same material is used in MEMS and NEMS. This chapter will review the techniques that have been used to determine the mechanical properties of micromachined structures, especially residual stress, strength and Young's modulus. The experimental measurements that have been performed will then be summarized, in particular the values obtained for polycrystalline silicon (polysilicon).

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References

  1. W. Nix: Mechanical properties of thin films, Metall. Trans. A 20, 2217–2245 (1989)

    Article  Google Scholar 

  2. G.G. Stoney: The tension of metallic films deposited by electrolysis, Proc. R. Soc. Lond. A 82, 172–175 (1909)

    Article  CAS  Google Scholar 

  3. W. Brantley: Calculated elastic constants for stress problems associated with semiconductor devices, J. Appl. Phys. 44, 534–535 (1973)

    Article  CAS  Google Scholar 

  4. A. Ni, D. Sherman, R. Ballarini, H. Kahn, B. Mi, S.M. Phillips, A.H. Heuer: Optimal design of multilayered polysilicon films for prescribed curvature, J. Mater. Sci., 38, 4169–4173 (2003)

    Article  CAS  Google Scholar 

  5. J.A. Floro, E. Chason, S.R. Lee, R.D. Twesten, R.Q. Hwang, L.B. Freund: Real-time stress evolution during Si1-xGex heteroepitaxy: Dislocations, islanding, and segregation, J. Electron. Mater. 26, 969–979 (1997)

    Article  CAS  Google Scholar 

  6. X. Li, B. Bhusan: Micro/nanomechanical characterization of ceramic films for microdevices, Thin Solid Films 340, 210–217 (1999)

    Article  CAS  Google Scholar 

  7. M.P. de Boer, H. Huang, J.C. Nelson, Z.P. Jiang, W.W. Gerberich: Fracture toughness of silicon and thin film micro-structures by wedge indentation, Mater. Res. Soc. Symp. Proc. 308, 647–652 (1993)

    Google Scholar 

  8. H. Guckel, D. Burns, C. Rutigliano, E. Lovell, B. Choi: Diagnostic microstructures for the measurement of intrinsic strain in thin films, J. Micromech. Microeng. 2, 86–95 (1992)

    Article  Google Scholar 

  9. F. Ericson, S. Greek, J. Soderkvist, J.-A. Schweitz: High sensitivity surface micromachined structures for internal stress and stress gradient evaluation, J. Micromech. Microeng. 7, 30–36 (1997)

    Article  CAS  Google Scholar 

  10. L.S. Fan, R.S. Muller, W. Yun, R.T. Howe, J. Huang: Spiral microstructures for the measurement of average strain gradients in thin films, Proc. IEEE Micro Electro Mechanical Systems Workshop, Napa Valley 1990 (IEEE, New York 1990) 177–182

    Google Scholar 

  11. M. Biebl, H. von Philipsborn: Fracture strength of doped and undoped polysilicon, Proc. Intl. Conf. Solid-State Sensors and Actuators, Stockholm 1995, ed. by S. Middelhoek, K. Cammann (Royal Swedish Academy of Engineering Sciences, Stockholm 1995) 72–75

    Google Scholar 

  12. L.S. Fan, R.T. Howe, R.S. Muller: Fracture toughness characterization of brittle films, Sens. Actuators A 21-23, 872–874 (1990)

    Article  Google Scholar 

  13. H. Kahn, R. Ballarini, J.J. Bellante, A.H. Heuer: Fatigue failure in polysilicon is not due to simple stress corrosion cracking, Science 298, 1215–1218 (2002)

    CAS  Google Scholar 

  14. H. Kahn, N. Tayebi, R. Ballarini, R.L. Mullen, A.H. Heuer: Wafer-level strength and fracture toughness testing of surface-micromachined MEMS devices, Mater. Res. Soc. Symp. Proc. 605, 25–30 (2000)

    CAS  Google Scholar 

  15. W.N. Sharpe Jr., B. Yuan, R.L. Edwards: A new technique for measuring the mechanical properties of thin films, J. Microelectromech. Syst. 6, 193–199 (1997)

    Article  Google Scholar 

  16. H.S. Cho, W.G. Babcock, H. Last, K.J. Hemker: Annealing effects on the microstructure and mechanical properties of LIGA nickel for MEMS, Mater. Res. Soc. Symp. Proc. 657 (2001) EE5.23.1–EE5.23.6

    Google Scholar 

  17. W. Suwito, M.L. Dunn, S.J. Cunningham, D.T. Read: Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures, J. Appl. Phys. 85, 3519–3534 (1999)

    Article  CAS  Google Scholar 

  18. C.-S. Oh, W.N. Sharpe: Techniques for measuring thermal expansion and creep of polysilicon, Sens. Actuators A 112, 66–73 (2004)

    Article  CAS  Google Scholar 

  19. T.P. Weihs, S. Hong, J.C. Bravman, W.D. Nix: Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films, J. Mater. Res. 3, 931–942 (1988)

    Article  Google Scholar 

  20. B.D. Jensen, M.P. de Boer, N.D. Masters, F. Bitsie, D.A. La Van: Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS, J. Microelectromech. Syst. 10, 336–346 (2001)

    Article  Google Scholar 

  21. M.G. Allen, M. Mehregany, R.T. Howe, S.D. Senturia: Microfabricated structures for the in situ measurement of residual stress, Young’s modulus, and ultimate strain of thin films, Appl. Phys. Lett. 51, 241–243 (1987)

    Article  CAS  Google Scholar 

  22. H. Kahn, S. Stemmer, K. Nandakumar, A.H. Heuer, R.L. Mullen, R. Ballarini, M.A. Huff: Mechanical properties of thick, surface micromachined polysilicon films, Proc. IEEE Micro Electro Mechanical Systems Workshop, San Diego 1996, ed. by M.G. Allen, M.L. Redd (IEEE, New York 1996) 343–348

    Google Scholar 

  23. L. Kiesewetter, J.-M. Zhang, D. Houdeau, A. Steckenborn: Determination of Young’s moduli of micromechanical thin films using the resonance method, Sens. Actuators A 35, 153–159 (1992)

    Article  Google Scholar 

  24. W.C. Tang, T.-C.H. Nguyen, R.T. Howe: Laterally driven polysilicon resonant microstructures, Sens. Actuators A 20, 25–32 (1989)

    Article  Google Scholar 

  25. P.T. Jones, G.C. Johnson, R.T. Howe: Fracture strength of polycrystalline silicon, Mater. Res. Soc. Symp. Proc. 518, 197–202 (1998)

    CAS  Google Scholar 

  26. P. Minotti, R. Le Moal, E. Joseph, G. Bourbon: Toward standard method for microelectromechanical systems material measurement through on-chip electrostatic probing of micrometer size polysilicon tensile specimens, Jpn. J. Appl. Phys. 40, L120–L122 (2001)

    Article  CAS  Google Scholar 

  27. C.L. Muhlstein, E.A. Stach, R.O. Ritchie: A reaction-layer mechanism for the delayed failure of micron-scale polycrystalline silicon structural films subjected to high-cycle fatigue loading, Acta Mater. 50, 3579–3595 (2002)

    Article  CAS  Google Scholar 

  28. A. Corigliano, B.De Masi, A. Frangi, C. Comi, A. Villa, M. Marchi: Mechanical characterization of polysilicon through on-chip tensile tests, J. Microelectromech. Syst. 13, 200–219 (2004)

    Article  CAS  Google Scholar 

  29. M.G. Lim, J.C. Chang, D.P. Schultz, R.T. Howe, R.M. White: Polysilicon microstructures to characterize static friction, Proc. IEEE Micro Electro Mechanical Systems Workshop, Napa Valley 1990 (IEEE, New York 1990) 82–88

    Google Scholar 

  30. B.T. Crozier, M.P. de Boer, J.M. Redmond, D.F. Bahr, T.A. Michalske: Friction measurement in MEMS using a new test structure, Mater. Res. Soc. Symp. Proc. 605, 129–134 (2000)

    CAS  Google Scholar 

  31. J. Yang, H. Kahn, A.Q. He, S.M. Phillips, A.H. Heuer: A new technique for producing large-area as-deposited zero-stress LPCVD polysilicon films: The MultiPoly process, J. Microelectromech. Syst. 9, 485–494 (2000)

    Article  CAS  Google Scholar 

  32. E. Chason, B.W. Sheldon, L.B. Freund, J.A. Floro, S.J. Hearne: Origin of compressive residual stress in polycrystalline thin films, Phys. Rev. Lett. 88 (2002) 156103-1–156103-4

    Article  CAS  Google Scholar 

  33. S. Jayaraman, R.L. Edwards, K.J. Hemker: Relating mechanical testing and microstructural features of polysilicon thin films, J. Mater. Res. 14, 688–697 (1999)

    Article  CAS  Google Scholar 

  34. R. Ballarini, H. Kahn, N. Tayebi, A.H. Heuer: Effects of microstructure on the strength and fracture toughness of polysilicon: A wafer level testing approach, ASTM STP 1413, 37–51 (2001)

    Google Scholar 

  35. J. Bagdahn, J. Schischka, M. Petzold, W.N. Sharpe Jr.: Fracture toughness and fatigue investigations of polycrystalline silicon, Proc. SPIE 4558, 159–168 (2001)

    Article  CAS  Google Scholar 

  36. I.S. Raju, J.C. Newman Jr.: Stress intensity factors for a wide range of semi-elliptical surface cracks in finite-thickness plates, Eng. Fract. Mech. 11, 817–829 (1979)

    Article  Google Scholar 

  37. J. Bagdahn, W.N. Sharpe Jr., O. Jadaan: Fracture strength of polysilicon at stress concentrations, J. Microelectromech. Syst., 302–312 (2003)

    Google Scholar 

  38. T. Yi, L. Li, C.-J. Kim: Microscale material testing of single crystalline silicon: Process effects on surface morphology and tensile strength, Sens. Actuators A 83, 172–178 (2000)

    Article  Google Scholar 

  39. X. Li, T. Kasai, S. Nakao, T. Ando, M. Shikida, K. Sato, H. Tanaka: Anisotropy in fracture of single crystal silicon film characterized under uniaxial tensile condition, Sens. Actuators A 117, 143–150 (2005)

    Article  CAS  Google Scholar 

  40. H. Kahn, R. Ballarini, R.L. Mullen, A.H. Heuer: Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens, Proc. R. Soc. Lond. A 455, 3807–3923 (1999)

    CAS  Google Scholar 

  41. W.W. Van Arsdell, S.B. Brown: Subcritical crack growth in silicon MEMS, J. Microelectromech. Syst. 8, 319–327 (1999)

    Article  Google Scholar 

  42. A. Corwin, M.P.de Boer: Effect of adhesion on dynamic and static friction in surface micromachining, Appl. Phys. Lett. 84, 2451–2453 (2004)

    Article  CAS  Google Scholar 

  43. T. Tsuchiya, A. Inoue, J. Sakata: Tensile testing of insulating thin films; humidity effect on tensile strength of SiO2 films, Sens. Actuators A 82, 286–290 (2000)

    Article  Google Scholar 

  44. H. Ogawa, K. Suzuki, S. Kaneko, Y. Nakano, Y. Ishikawa, T. Kitahara: Measurements of mechanical properties of microfabricated thin films, Proc. IEEE Micro Electro Mechanical Systems Workshop (IEEE, New York 1997) 430–435

    Google Scholar 

  45. R.L. Edwards, G. Coles, W.N. Sharpe: Comparison of tensile and bulge tests for thin-film silicon nitride, Exp. Mech. 44, 49–54 (2004)

    Article  CAS  Google Scholar 

  46. S. Cho, I. Chasiotis, T.A. Friedmann, J.P. Sullivan: Young’s modulus, Poisson’s ratio and failure properties of tetrahedral amorphous diamond-like carbon for MEMS devices, J. Micromech. Microeng. 15, 728–735 (2005)

    Article  CAS  Google Scholar 

  47. D. Son, J.-H. Jeong, D. Kwon: Film-thickness considerations in microcantilever-beam test in measuring mechanical properties of metal thin film, Thin Solid Films 437, 182–187 (2003)

    Article  CAS  Google Scholar 

  48. W.-H. Chuang, T. Luger, R.K. Fettig, R. Ghodssi: Mechanical property characterization of LPCVD silicon nitride thin films at cryogenic temperatures, J. Microelectromech. Syst. 13, 870–879 (2004)

    Article  Google Scholar 

  49. H.D. Espinosa, B. Peng: A new methodology to investigate fracture toughness of freestanding MEMS and advanced materials in thin film form, J. Microelectromech. Syst. 14, 153–159 (2005)

    Article  Google Scholar 

  50. C.-W. Baek, Y.-K. Kim, Y. Ahn, Y.-H. Kim: Measurement of the mechanical properties of electroplated gold thin films using micromachined beam structures, Sens. Actuators A 117, 17–27 (2005)

    Article  CAS  Google Scholar 

  51. R. Yokokawa, J.-A. Paik, B. Dunn, N. Kitazawa, H. Kotera, C.-J. Kim: Mechanical properties of aerogel-like thin films used for MEMS, J. Micromech. Microeng. 14, 681–686 (2004)

    Article  Google Scholar 

  52. A. Kaushik, H. Kahn, A.H. Heuer: Wafer-level mechanical characterization of silicon nitride MEMS, J. Microelectromech. Syst. 14, 359–367 (2005)

    Article  Google Scholar 

  53. S. Roy, C.A. Zorman, M. Mehregany: The mechanical properties of polycrystalline silicon carbide films determined using bulk micromachined diaphragms, Mater. Res. Soc. Symp. Proc. 657 (2001) EE9.5.1–EE9.5.6

    Google Scholar 

  54. J.J. Bellante, H. Kahn, R. Ballarini, C.A. Zorman, M. Mehregany, A.H. Heuer: Fracture toughness of polycrystalline silicon carbide thin films, Appl. Phys. Lett. 86, 071920–1–071920–3 (2005)

    Article  CAS  Google Scholar 

  55. A.J. Fleischman, X. Wei, C.A. Zorman, M. Mehregany: Surface micromachining of polycrystalline SiC deposited on SiO2 by APCVD, Mater. Sci. Forum 264-268, 885–888 (1998)

    Article  Google Scholar 

  56. A.E. Franke, E. Bilic, D.T. Chang, P.T. Jones, T.-J. King, R.T. Howe, G.C. Johnson: Post-CMOS integration of germanium microstructures, Proc. Int. Conf. Solid-State Sensors and Actuators (IEE Japan, Tokyo 1999) 630–637

    Google Scholar 

  57. D. Gao, C. Carraro, V. Radmilovic, R.T. Howe, R. Maboudian: Fracture of polycrystalline 3C-SiC films in microelectromechanical systems, J. Microelectromech. Syst. 13, 972–976 (2004)

    Article  CAS  Google Scholar 

  58. M.A. Haque, M.T.A. Saif: A review of MEMS-based microscale and nanoscale tensile and bending testing, Exp. Mech. 43, 248–255 (2003)

    Article  Google Scholar 

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  1. Department of Materials Science and Engineering, Case Western Reserve University, 10900 Euclid Ave, 44106-7204, Cleveland, OH, USA

    Harold Kahn

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Kahn, H. (2008). Mechanical Properties of Micromachined Structures. In: Nanotribology and Nanomechanics. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-77608-6_23

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