Low-Cost, Single-Chip Amplified Pressure Sensor in a Moulded Package for Tire Pressure Measurement and Motor Management

Abstract

Advanced automotive sensor systems used for tire pressure measurements and motor management show a strong demand for increased robustness, functionality and flexibility at reasonable low costs. To meat these requirements a single-chip sensor in a low cost package has significant advantages compared to other existing solutions. By combining silicon micro-machining designs and processes with advanced mixed-signal CMOS circuitry, many of the early limitations of single-chip sensors can be overcome. The result is a highperformance single chip pressure sensor that provides an amplified and calibrated output. Co-integration of sensor, CMOS amplification and EEPROM on a single chip results in a sensor structure that can be completely moulded into the package prior to calibration and compensation. The calibration and compensation parameters are then programmed into the package on an automated tester, providing a very low-cost high-volume sensor element.