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Process Diagnostics

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Reactive Sputter Deposition

Part of the book series: Springer Series in Materials Science ((SSMATERIALS,volume 109))

Reactive sputtering of materials can be carried out using a number of different types of plasma excitation methods including DC, RF, Pulsed DC and AC, with the power applied to a sputter cathode. The usual configuration adopted in industry is the magnetron, operated typically in the so-called unbalanced mode. Although DC and RF excitation are often employed in non-reactive plasmas, with each technique having its own particular advantages (e.g. DC is high rate, RF can sputter many types of targets), it has become common when introducing reactive gases like oxygen or nitrogen to modulate the discharge power by pulsing the driving voltage waveform.

This chapter reviews most of the recent investigations of reactive sputter deposition processes using plasma diagnostic techniques. Special emphasis is placed on the increasingly popular method of mid-frequency pulsed magnetron sputtering. Despite being closely related, the relatively new technique of high-power pulsed ionised magnetron sputtering (HPPMS or HIPIMS, see, e.g. [5, 6]) with extremely short voltage pulses compared to pulse repetition time, is not covered in much detail here. The chapter is subdivided into different plasma diagnostic methods such as electric probes, mass spectrometry, optical emission spectroscopy (OES) and laser-induced fluorescence (LIF). Each method is briefly described and its application to particular aspects of reactive sputtering is presented.

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  1. Department of Electrical Engineering and Electronics, University of Liverpool, L69 3GJ, Liverpool, UK

    James W. Bradley

  2. Institute of Physics, Chemnitz University of Technology, 09107, Chemnitz, Germany

    Thomas Welzel

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    Diederik Depla  & Stijn Mahieu  & 

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Bradley, J.W., Welzel, T. (2008). Process Diagnostics. In: Depla, D., Mahieu, S. (eds) Reactive Sputter Deposition. Springer Series in Materials Science, vol 109. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-76664-3_8

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