Abstract
Continuous miniaturization of electronic products & components and parallel increase their functionality in modern applications together with the EU RoHS directive restrictions delivers everlasting technological difficulties.
The problems with materials, assembly and soldering equipments selection, printing solder paste both on very small and big PCB pads, optimization of soldering processes for lead-free complex board were shown at the article.
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References
Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment, Official Journal of the European Union, 13.02.2003, pp. 19–23
J. Klerk, „Large & Complex Boards“. ELFNET at SEMICON Conference, 5–6th April 2006, Munich, Germany
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© 2007 Springer-Verlag Berlin Heidelberg
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Sitek, J., Drozd, Z., Bukat, K. (2007). Assembly and soldering process in Lead-free Technology. In: Jabłoński, R., Turkowski, M., Szewczyk, R. (eds) Recent Advances in Mechatronics. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-73956-2_67
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DOI: https://doi.org/10.1007/978-3-540-73956-2_67
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-73955-5
Online ISBN: 978-3-540-73956-2
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