A detailed numerical methodology is presented for electron-beam based processing with a single or an array of electron beams. Monte Carlo simulations based on the continuous slow-down approach are carried out to predict the electron-energy deposition distribution inside a metallic workpiece. Results from these simulations are coupled with the Fourier heat conduction equation to determine the temperature distribution within the medium. Results for both the single electron-beam as well as sequential heating are presented.
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© 2008 Springer-Verlag Berlin Heidelberg
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(2008). Thermal Conduction Coupled with e-Beam Transport. In: Thermal Transport for Applications in Micro/Nanomachining. Microtechnology and MEMS. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-73607-3_5
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DOI: https://doi.org/10.1007/978-3-540-73607-3_5
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-73605-9
Online ISBN: 978-3-540-73607-3
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