Pressure Monitoring Sensing Market - Who will win the Race between Hybrid vs Monolithic Integrated Products?

Abstract

Automotive applications are still driving new MEMS development for new applications. Pressure monitoring application is one of the very dynamic one in particular. This article highlights the evolution of the pressure monitoring sensors both at the component and module level. New product announcements have recently fragmented the product offer in two kinds: Hybrid modules vs. single die packaged modules. This change will strongly affect current player position. This paper will present market needs, status, and trends, to discuss which players will win the race.

Starting with an historical reminder of TPM application, current OEM needs will be described followed by 2006 - 2010 market estimation. In particular, we will focus the discussion on the evolution of the s functions: which level of integration will s support. The final part of the presentation will highlight how the new TPM product offering will impact the industrial chain.