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Computational Textile pp 255–263Cite as

Numerical Simulation of Heat and Moisture Transfer in Porous Walls with Microencapsulated PCM

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Part of the book series: Studies in Computational Intelligence ((SCI,volume 55))

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References

  • Li Y., Zhu Q. Y. (2003). “A Model of Coupled Liquid Moisture and Heat Transfer in Porous Textiles with Consideration of Gravity. ” Numerical Heat Transfer, Part A, 43(3): 501-523.

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  • Li Y., Zhu Q. Y. (2004). “A Model of the Heat and Moisture Transfer in Porous Textiles with Phase Change Materials. ” Textile Res. J, 74(5): 447-457.

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Author information

Authors and Affiliations

  1. Institute of Textiles & Clothing, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China

    Y. Li

  2. School of Engineering and Information Technology, Deakin University, Geelong, 3217, Victoria, Australia

    X. Wang

  3. Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hong Kong, China

    S. Li

  4. Department of Building Service Engineering, The Hong Kong, Hong Kong, China

    J. L. Niu

Authors
  1. Y. Li
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  2. X. Wang
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  3. S. Li
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  4. J. L. Niu
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Editor information

Editors and Affiliations

  1. Ecole Nationale Supérieure des Arts et Industries Textiles (ENSAIT), 9 Rue de I'Ermitage, 59056, Roubaix CX 01, France

    Xianyi Zeng

  2. Institute of Textiles & Clothing, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China

    Yi Li

  3. The Belgian Nuclear Research Center (SCK ·CEN), Boeretang 200, 2400, MOL, Belgium

    Da Ruan

  4. Ecole Nationale Supérieure des Arts et Industries Textiles (ENSAIT), 9 Rue de I'Ermitage, 59056, Roubaix CX 01, France

    Ludovic Koehl

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© 2007 Springer-Verlag Berlin Heidelberg

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Li, Y., Wang, X., Li, S., Niu, J.L. (2007). Numerical Simulation of Heat and Moisture Transfer in Porous Walls with Microencapsulated PCM. In: Zeng, X., Li, Y., Ruan, D., Koehl, L. (eds) Computational Textile. Studies in Computational Intelligence, vol 55. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-70658-8_16

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  • DOI: https://doi.org/10.1007/978-3-540-70658-8_16

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-70656-4

  • Online ISBN: 978-3-540-70658-8

  • eBook Packages: EngineeringEngineering (R0)

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