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Time Domain Methods in Electrodynamics pp 19–29Cite as

Full-Wave Simulation of Integrated Circuit Packages on a Parallel Architecture

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Part of the book series: Springer Proceedings in Physics ((SPPHY,volume 121))

Abstract

The time domain electromagnetic field simulation based on massive parallelization is presented as a tool for the signal integrity analysis of complex IC packages. The simulations are based on a specialized domain partitioning method which allows for highly balanced parallel computations. As a real-world example the analysis of a large computer chip spreader is performed. Numerical results including signal wave forms and delay times are given.

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References

  1. E.-P. Li, E.-X. Liu, and L.-W. Li (2004) “A Coupled Efficient and Systematic Full-Wave Time-Domain Macromodeling and Circuit Simulation Method for Signal Integrity Analysis of High-Speed Interconnects”, IEEE Trans. on Adv. Packaging, Vol. 27, No. 1, Feb. 2004, pp. 213–223

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  6. IBM, Thomas J. Watson Research Center, Yorktown Heights, NY, private communications

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Author information

Authors and Affiliations

  1. Institut für Theorie Elektromagnetischer Felder, Technische Universität Darmstadt, Schlossgartenstr. 8, 64289 Darmstadt, Germany

    Erion Gjonaj, Andreas Barchanski & Thomas Weiland

  2. Computer Simulation Technology GmbH, Bad Nauheimerstr. 19, 64289 Darmstadt, Germany

    Peter Thoma

Authors
  1. Erion Gjonaj
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  2. Andreas Barchanski
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  3. Peter Thoma
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  4. Thomas Weiland
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Editor information

Editors and Affiliations

  1. TU München Fak. Elektro- und Informationstechnik LS Hochfrequenztechnik, Arcisstr. 21, 80333 München, Germany

    Peter Russer (Prof. Dr.) & Uwe Siart (Dr.) (Prof. Dr.) &  (Dr.)

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© 2008 Springer-Verlag Berlin Heidelberg

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Gjonaj, E., Barchanski, A., Thoma, P., Weiland, T. (2008). Full-Wave Simulation of Integrated Circuit Packages on a Parallel Architecture. In: Russer, P., Siart, U. (eds) Time Domain Methods in Electrodynamics. Springer Proceedings in Physics, vol 121. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-68768-9_2

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  • DOI: https://doi.org/10.1007/978-3-540-68768-9_2

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-68766-5

  • Online ISBN: 978-3-540-68768-9

  • eBook Packages: EngineeringEngineering (R0)

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