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Cutting of Diamond

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Part of the book series: Topics in Applied Physics ((TAP,volume 96))

Abstract

For a number of years, diamond has been used as a material for cutting tools. Since conventional machining of diamond is difficult and expensive, laser cutting is considered a promising technology for future production of diamond-cutting tools. Experiments with nanosecond-lasers showed a tendency to crack formation in the material, especially in monocrystalline diamond. With femtosecond laser pulses it is possible to avoid the cracks. The roughness of the laser cut surface is better than the surface produced by EDM, but inferior to a polished one. The cutting speed with available laser systems is, however, low compared to conventional techniques.

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Friedrich Dausinger Holger Lubatschowski Friedemann Lichtner

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Weikert, M., Dausinger, F. Cutting of Diamond. In: Dausinger, F., Lubatschowski, H., Lichtner, F. (eds) Femtosecond Technology for Technical and Medical Applications. Topics in Applied Physics, vol 96. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-39848-6_11

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  • DOI: https://doi.org/10.1007/978-3-540-39848-6_11

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-20114-4

  • Online ISBN: 978-3-540-39848-6

  • eBook Packages: Springer Book Archive

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