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STM Studies on Molecular Assembly at Solid/Liquid Interfaces

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Applied Scanning Probe Methods VI

Part of the book series: NanoScience and Technology ((NANO))

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13.6 Conclusions

In situ STM measurements revealed the SA process and structures of SAMs at solid/liquid interfaces with molecular resolution. Achemisorbed molecular assembly of alkanethiols proceeds with complex 2D phase transitions. A physisorbed organic molecular assembly was observed in neat liquids of n-alkanes on Au(111) and (100) surfaces. The monolayer structure is strongly related to the molecule-molecule interactions on a Au(111) surface. The chemisorbed and physisorbed molecular assemblies of metal complexes were discovered by in situ scanning tunneling microscopz. It was clarified that the SA of molecules is one of the important steps in electrodeposition of a metal layer.

The nature of SA is being revealed by in situ analytical tools. Further studies on experimental and theoretical aspects of the SA process would make SA techniques much more predictable and reliable. Scanning probe techniques will continue to play leading roles in future studies.

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Authors and Affiliations

  1. Division of Material Physics, Graduate School of Engineering Science Osaka University, Machikaneyama-1-3, Toyonaka, Osaka, 060-0810, Japan

    Ryo Yamada

  2. Division of Chemistry, Graduate School of Science, Hokkaido University, N10 W8, Sapporo, Hokkaido, 060-0810, Japan

    Kohei Uosaki

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  1. Nanotribology Laboratory for Information Storage and MEMS/NEMS (NLIM) 390 Scott Laboratory, The Ohio State University, 201 W. 19th Avenue, Columbus, Ohio, 43210-1142, USA

    Bharat Bhushan

  2. Graduate School of Science, Department of Mathematics, Osaka City University, Sugimoto 3-3-138, 558-8585, Osaka, Japan

    Satoshi Kawata

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Yamada, R., Uosaki, K. (2007). STM Studies on Molecular Assembly at Solid/Liquid Interfaces. In: Bhushan, B., Kawata, S. (eds) Applied Scanning Probe Methods VI. NanoScience and Technology. Springer, Berlin, Heidelberg . https://doi.org/10.1007/978-3-540-37319-3_3

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