Skip to main content

Praktischer Schaltungsaufbau

  • Chapter
Elektronische Bauelemente
  • 8391 Accesses

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 149.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book
USD 199.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

5.5 Literaturverzeichnis

  1. C.F. Coombs (Ed.). Printed Circuits Handbook. McGraw-Hill, New York, 5th edition, 2001.

    Google Scholar 

  2. W. Jillek, G. Keller (Hrsg.). Handbuch der Leiterplattentechnik-Band 4. Eugen Leuze, Saulgau, 2003.

    Google Scholar 

  3. H.-J. Hanke (Hrsg.). Baugruppentechnologie der Elektronik-Leiterplatten. Verlag Technik, Berlin, 1994.

    Google Scholar 

  4. W. Scheel (Hrsg.). Baugruppentechnologie der Elektronik-Montage. Verlag Technik, Berlin, 2. Auflage, 1999.

    Google Scholar 

  5. R.J. Klein Wassinik. Soldering in Electronics. Electrochemical Publications Ltd, Ayr, Scotland, 2nd edition, 1989.

    Google Scholar 

  6. R. Sautter. Leiterplatten mit oberflächenmontierten Bauelementen. Vogel, Würzburg, 1988.

    Google Scholar 

  7. S.K. Kang, P.A. Lauro, D.-Y. Shih, D.W. Henderson, K.J. Puttlitz. Microstrusture and mechanical properties of lead-free solders and solder joints used in micrelectronic applications. IBM J. Res. and Dev., 49(4/5):607–620, 2005.

    Article  Google Scholar 

  8. H. Reichl (Hrsg.). Hybridintegration. Hüthig, Heidelberg, 1986.

    Google Scholar 

  9. Ch.A. Harper (Ed.). Electronic Packaging and Interconnection Handbook. McGraw Hill, New York, 3rd edition, 2000.

    Google Scholar 

  10. H. Reichl (Hrsg.). Direktmontage. Springer, Heidelberg, 1998.

    Google Scholar 

  11. SIEMENS. Bauelemente-Technische Erläuterungen und Kenndaten für Studierende. Siemens-Bereich Bauelemente, München, 4. Auflage, 1984.

    Google Scholar 

  12. D.C. Wunsch, R.R. Bell. Determination of threshold failure levels of semiconductor diodes and transistors due to pulse voltages. IEEE Trans. Nucl. Sci., NS-15:244–259, 1968.

    Article  Google Scholar 

  13. R.R. Heikes, W.W. Ure. Thermoelectricity. Interscience, New York, 1961.

    Google Scholar 

  14. E. Schaefer. Zuverlässigkeit, Verfügbarkeit und Sicherheit in der Elektronik. Vogel, Würzburg, 1979.

    Google Scholar 

  15. J.E. Vinson, J.J. Liou. Electrostatic discharge in semiconductor devices: protection techniques. Proc. IEEE, 88(12):1878–1900, 2000.

    Article  Google Scholar 

  16. C. Duvvury, A. Amerasekera. ESD: A pervasive reliability concern for IC technologies. Proc. IEEE, 81(5):690–702, 1993.

    Article  Google Scholar 

  17. Analog Devices. Electrically induced damage to standard linear integrated circuits: the most common causes and the associated fixes to prevent reoccurence. Application Note 397.

    Google Scholar 

Download references

Rights and permissions

Reprints and permissions

Copyright information

© 2007 Springer-Verlag Berlin Heidelberg

About this chapter

Cite this chapter

(2007). Praktischer Schaltungsaufbau. In: Elektronische Bauelemente. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-34015-7_5

Download citation

Publish with us

Policies and ethics