Abstract
During the past years, ultrasonic wedgebonding has attracted much attention because it is one of the keystones of the Chip-On-Board technology, which allows to considerably increase the packaging density of complex electronic devices. In order to achieve high quality and productivity, fully automated ultrasonic wedgebonding machines with small cycle time are required. In the process of product development, special attention must be paid to meet the demands of very accurate high speed positioning in combination with the delicate handling of the bonding wire. In this paper a mechatronic design approach is described which is based on functional modelling of the main components of a bonding machine in terms of so called mechatronic function modules. In particular the modelling of a piezoelectric bimorph actuator is studied in detail.
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© 1995 Springer Fachmedien Wiesbaden
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Hesse, H., Wallaschek, J. (1995). Optimization of the dynamic behavior of a wire bonder using the concept of mechatronic function modules. In: Lückel, J. (eds) Proceedings of the Third Conference on Mechatronics and Robotics. Vieweg+Teubner Verlag, Wiesbaden. https://doi.org/10.1007/978-3-322-91170-4_26
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DOI: https://doi.org/10.1007/978-3-322-91170-4_26
Publisher Name: Vieweg+Teubner Verlag, Wiesbaden
Print ISBN: 978-3-519-02625-9
Online ISBN: 978-3-322-91170-4
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