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Thermomechanical Modeling of High-Temperature Bonded Interface Materials

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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Abstract

In an automotive power electronics package, bonded interface materials play a critical role in providing a smooth heat dissipation path from the device to the coolant. However, these materials are susceptible to failure when the package gets exposed to repeated changes in its thermal environment and internal temperature variations. Under these thermal conditions, the coefficient of thermal expansion mismatch between the different component layers results in thermally induced stresses and consequently the delamination of the material from its adjoining surfaces or crack initiation and propagation within the material. Thermomechanical modeling offers a path to study the complex nature of these bonded materials, guides their design and selection, and, in conjunction with experimental results, plays an important role in predicting their lifetime. In this chapter, two modeling strategies—similar in approach and implementation but different in the underlying theory—are discussed in the context of high-temperature bonded materials. In addition, a short review of sintered silver is provided, as it is widely seen as a potentially promising and reliable bonded material for high-temperature applications.

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Acknowledgments

We acknowledge the financial support for the work provided by Susan Rogers, the technology manager for the Electric Drive Technologies Program, Vehicle Technologies Office, US Department of Energy Office of Energy Efficiency and Renewable Energy (EERE). This work was supported by the US Department of Energy under Contract No. DE-AC36-08GO28308 with Alliance for Sustainable Energy, LLC, the manager and operator of the National Renewable Energy Laboratory. We would also like to thank Andrew Wereszczak (Oak Ridge National Laboratory) for his guidance and insightful comments on fracture mechanics-based modeling of sintered silver. The U.S. Government retains and the publisher, by accepting the article for publication, acknowledges that the US Government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this work or allow others to do so, for U.S. Government purposes.

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Authors and Affiliations

  1. National Renewable Energy Laboratory (NREL), Golden, CO, USA

    P. P. Paret, D. J. DeVoto & S. V. J. Narumanchi

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  1. P. P. Paret
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  2. D. J. DeVoto
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  3. S. V. J. Narumanchi
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Correspondence to P. P. Paret .

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Editors and Affiliations

  1. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi Selangor, Malaysia

    Kim S. Siow

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Paret, P.P., DeVoto, D.J., Narumanchi, S.V.J. (2019). Thermomechanical Modeling of High-Temperature Bonded Interface Materials. In: Siow, K. (eds) Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-99256-3_4

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