Abstract
A duty-cycled bridge-to-digital converter (BDC) for small battery operated pressure sensing systems is presented and demonstrated in two complete microsystems. By heavily duty-cycling an excitation voltage for the bridge sensor, 6000× less excitation power is consumed compared with conventional DC biasing. The excitation voltage is sampled and used to generate an ADC reference voltage to avoid line voltage fluctuation. The BDC achieves 49.2 dB SNR and 2.5 nJ conversion energy with 10.6 pJ/c.s. FOM.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Jiang H, Makinwa KAA, Nihtianov S. 9.8 An energy-efficient 3.7nV/√Hz bridge-readout IC with a stable bridge offset compensation scheme. In 2017 IEEE International Solid-State Circuits Conference (ISSCC), 2017, pp. 172–3.
Grezaud R, Sibeud L, Lepin F, Willemin J, Riou JC, Gomez B. A robust and versatile, -40°C to +180°C, 8Sps to 1kSps, multi power source wireless sensor system for aeronautic applications. In 2017 Symposium on VLSI Circuits, 2017, pp. C310–1.
Nguyen TT, Fernandes LAL, Hafliger P. An energy-efficient implantable transponder for biomedical piezo-resistance pressure sensors. IEEE Sens J. 2014;14(6):1836–43.
Donida A, et al. A circadian and cardiac intraocular pressure sensor for smart implantable lens. IEEE Trans Biomed Circuits Syst. 2015;9(6):777–89.
Zang Y, Zhang F, Di C, Zhu D. Advances of flexible pressure sensors toward artificial intelligence and health care applications. Mater Horiz. 2015;2(2):140–56.
Gubbi J, Buyya R, Marusic S, Palaniswami M. Internet of Things (IoT): a vision, architectural elements, and future directions. Future Gener Comput Syst. 2013;29(7):1645–60.
Oh S, et al. A dual-slope capacitance-to-digital converter integrated in an implantable pressure-sensing system. IEEE J Solid-State Circuits. 2015;50(7):1581–91.
Kim G, et al. A millimeter-scale wireless imaging system with continuous motion detection and energy harvesting. In 2014 Symposium on VLSI Circuits Digest of Technical Papers, 2014, pp. 1–2.
Blaauw D, et al.. IoT design space challenges: Circuits and systems. In 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014, pp. 1–2.
EnerChip, Cymbet Corporation. [Online]. Available: http://www.cymbet.com/. Accessed: 13-Mar-2018.
Maruyama M, Taguchi S, Yamanoue M, Iizuka K. An analog front-end for a multifunction sensor employing a weak-inversion biasing technique with 26 nVrms, 25 aCrms, and 19 fArms input-referred noise. IEEE J Solid-State Circuits. 2016;51(10):2252–61.
Wu R, Chae Y, Huijsing JH, Makinwa KAA. A 20-b ±40-mV range read-out IC with 50-nV offset and 0.04% gain error for bridge transducers. IEEE J Solid-State Circuits. 2012;47(9):2152–63.
Jun J, Rhee C, Kim M, Kang J, Kim S. 19.7 A 21.8b sub-100μHz 1/f corner 2.4μV-offset programmable-gain read-out IC for bridge measurement systems. In 2018 IEEE International Solid-State Circuits Conference (ISSCC), 2018.
Oh S, et al.. 19.6 A 2.5nJ duty-cycled bridge-to-digital converter integrated in a 13mm2 pressure-sensing system. In 2018 IEEE International Solid-State Circuits Conference (ISSCC), 2018.
Bang S, Blaauw D, Sylvester D, Alioto M. Reconfigurable sleep transistor for GIDL reduction in ultra-low standby power systems. In Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 2012, pp. 1–4.
Jeong S, et al.. 21.6 A 12nW always-on acoustic sensing and object recognition microsystem using frequency-domain feature extraction and SVM classification. In 2017 IEEE International Solid-State Circuits Conference (ISSCC), 2017, pp. 362–3.
Ginsburg BP, Chandrakasan AP. 500-MS/s 5-bit ADC in 65-nm CMOS with split capacitor array DAC. IEEE J Solid-State Circuits. 2007;42(4):739–47.
Kuo YS, et al. MBus: A 17.5 pJ/bit/chip portable interconnect bus for millimeter-scale sensor systems with 8 nW standby power. In Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, 2014, pp. 1–4.
Lee Y, et al. A modular 1 mm die-stacked sensing platform with low power I C inter-die communication and multi-modal energy harvesting. IEEE J Solid-State Circuits. 2013;48(1):229–43.
Ghaed MH, et al. Circuits for a cubic-millimeter energy-autonomous wireless intraocular pressure monitor. IEEE Trans Circuits Syst Regul Pap. 2013;60(12):3152–62.
Jung W, et al. An ultra-low power fully integrated energy harvester based on self-oscillating switched-capacitor voltage doubler. IEEE J Solid-State Circuits. 2014;49(12):2800–11.
Teran AS, et al. AlGaAs photovoltaics for indoor energy harvesting in mm-scale wireless sensor nodes. IEEE Trans Electron Devices. 2015;62(7):2170–5.
Jung W, et al. 8.5 A 60%-efficiency 20nW-500μW tri-output fully integrated power management unit with environmental adaptation and load-proportional biasing for IoT systems. In 2016 IEEE International Solid-State Circuits Conference (ISSCC), 2016, pp. 154–5.
C39, TDK Europe – EPCOS. [Online]. Available: https://en.tdk.eu/pressure_sensor_elements. Accessed: 13-Mar-2018.
K-Series, Merit Sensor. [Online]. Available: https://meritsensor.com/. Accessed: 13-Mar-2018.
Lim W, Jang T, Lee I, Kim H-S, Sylvester D, Blaauw D. A 380pW dual mode optical wake-up receiver with ambient noise cancellation. In 2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits), 2016, pp. 1–2.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer Nature Switzerland AG
About this chapter
Cite this chapter
Oh, S. et al. (2019). Low-Power Resistive Bridge Readout Circuit Integrated in Two Millimeter-Scale Pressure-Sensing Systems. In: Makinwa, K., Baschirotto, A., Harpe, P. (eds) Low-Power Analog Techniques, Sensors for Mobile Devices, and Energy Efficient Amplifiers . Springer, Cham. https://doi.org/10.1007/978-3-319-97870-3_6
Download citation
DOI: https://doi.org/10.1007/978-3-319-97870-3_6
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-97869-7
Online ISBN: 978-3-319-97870-3
eBook Packages: EngineeringEngineering (R0)