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Evaluation of Mixed-Mode Fracture in Adhesively-Bonded Joints

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Innovation, Engineering and Entrepreneurship (HELIX 2018)

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 505))

Abstract

To enable the widespread use of adhesive joints in industry application, it is fundamental to be able to predict their strength. Advanced predictive techniques such as cohesive zone models (CZM) require the estimation of both mechanical and fracture properties of adhesives. In this work, the Asymmetric Tapered Double-Cantilever Beam (ATDCB) mixed-mode test is studied to estimate the fracture envelope of three adhesives. The R-curves were calculated and the fracture envelopes of each adhesive were built, which enabled calculating the most suitable propagation criterion in mixed-mode to apply in numerical simulations. With this work, the mixed-mode propagation criterion of three adhesives was proposed for strength prediction of adhesive joints.

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Author information

Authors and Affiliations

  1. Departamento de Engenharia Mecânica, Instituto Superior de Engenharia do Porto, Instituto Politécnico do Porto, Rua Dr. António Bernardino de Almeida, 431, 4200-072, Porto, Portugal

    Filipe A. A. Nunes & Raul D. S. G. Campilho

  2. INEGI – Pólo FEUP, Rua Dr. Roberto Frias, 400, 4200-465, Porto, Portugal

    Raul D. S. G. Campilho

Authors
  1. Filipe A. A. Nunes
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  2. Raul D. S. G. Campilho
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Corresponding author

Correspondence to Raul D. S. G. Campilho .

Editor information

Editors and Affiliations

  1. School of Engineering, University of Minho, Guimarães, Portugal

    José Machado

  2. School of Engineering, University of Minho, Guimarães, Portugal

    Filomena Soares

  3. Faculty of Engineering, University of Porto, Porto, Portugal

    Germano Veiga

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Nunes, F.A.A., Campilho, R.D.S.G. (2019). Evaluation of Mixed-Mode Fracture in Adhesively-Bonded Joints. In: Machado, J., Soares, F., Veiga, G. (eds) Innovation, Engineering and Entrepreneurship. HELIX 2018. Lecture Notes in Electrical Engineering, vol 505. Springer, Cham. https://doi.org/10.1007/978-3-319-91334-6_61

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