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Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects

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Abstract

Adhesion and delamination have been pervasive problems hampering the performance and reliability of micro- and nano-electronic devices. In order to understand, predict, and ultimately prevent interface failure in electronic devices, development of accurate, robust, and efficient delamination testing and prediction methods is crucial. Adhesion is essentially a multi-scale phenomenon: at the smallest scale possible, it is defined by the thermodynamic work of adhesion. At larger scales, additional dissipative mechanisms may be active which results in enhanced adhesion at the macroscopic scale and are the main cause for the mode angle dependency of the interface toughness. Undoubtedly, the macroscopic adhesion properties are a complex function of all dissipation mechanisms across the scales. Thorough understanding of the significance of each of these dissipative mechanisms is of utmost importance in order to establish physically correct, unambiguous values of the adhesion properties, which can only be achieved by proper multi-scale techniques.

The topic “Advances in Delamination Modeling” has been split into two separate chapters: this chapter discusses the continuum aspects of delamination, while the next chapter deals with the atomistic aspects of interface separation. The chapter starts with a concise overview of the theory on interface fracture mechanics, followed by five applications: (1) buckling-driven delamination in flexible displays, in which a combined numerical-experimental approach is used to establish macroscopic adhesion properties, as a function of mode angle; (2) a multi-scale method to identify the relevant dissipative mechanisms in fibrillating metal/elastomer interfaces that are encountered in stretchable electronics; (3) analysis and prediction of a particular microscale dissipative mechanism at patterned (roughened) interfaces, as a result of the competition between adhesive and cohesive failures; (4) advanced model parameter identification by integrated digital image correlation which essentially eliminates the need for calculating displacements from images prior to parameter identification; and (5) the modeling of the sintering behavior of Ag particles in a thermal interconnect material.

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Acknowledgments

The authors are grateful to the following colleagues, (former) students, and funding sources:

  • Buckling-driven delamination in flexible displays: Amir Abdallah, Piet Bouten, Peter Timmermans, Jaap den Toonder, and Patrick Ooms as well as the financial support of the EC under contract IST-2004-4354 (Flexidis)

  • Fibrillating interfaces in stretchable electronics: YY Hsu, Mario Gonzalez, Peter Timmermans, and Jan Vanfleteren as well as the financial support of the EC under contract IST-028026 (Stella) and of the Dutch Technology Foundation STW (Grant nrs. 08097 and 10108)

  • Adhesive and cohesive failure at patterned surfaces: Peter Timmermans, Sander Noijen, Kaipeng Hu, and Thijs Thurlings, as well as the financial support of the EC under contract NMP-2008-214371 (NanoInterface)

  • Small-scale parameter identification by means of IDIC: Marc van Maris and Salman Shafqat, as well as the financial support of the Materials Innovation Institute under project number M62.2.12472

  • Sintering of Ag particles: the financial support of the EC under contract ICT-318117 (NanoTherm)

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  1. Eindhoven University of Technology, Mechanics of Materials, Eindhoven, The Netherlands

    Olaf van der Sluis, Bart Vossen, Jan Neggers, Andre Ruybalid, Karthik Chockalingam, Ron Peerlings, Johan Hoefnagels, Joris Remmers, Varvara Kouznetsova, Piet Schreurs & Marc Geers

  2. Philips Research Laboratories, Product and Process Modelling, Eindhoven, The Netherlands

    Olaf van der Sluis

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  1. Olaf van der Sluis
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Correspondence to Olaf van der Sluis .

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  1. Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA

    James E. Morris

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van der Sluis, O. et al. (2018). Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects. In: Morris, J. (eds) Nanopackaging. Springer, Cham. https://doi.org/10.1007/978-3-319-90362-0_3

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