Abstract
Packaging materials undergo dimensional changes under environmental exposure to temperature change. Thermomechanical cyclic loads induce stresses and damage interconnects. Mechanical shock during operation may subject the board assemblies to large out-of-plane deformation. Underfills and potting compounds are often used to enhance the harsh environment reliability of electronics through addition of supplemental restraints to allow for increase in the design margins. The computational tools and experimental test methods for assessing the change in thermomechanical and mechanical shock reliability of fine-pitch electronics with supplemental restraints are discussed. Methods to model the mechanical properties of underfills using unit cell approaches for property prediction and viscoelastic models to capture the constitutive behavior along with experimental measurements of nano-underfills have been presented. The use of explicit finite element models for capturing the transient dynamic response under high-g mechanical shock of unpotted and potted electronics assemblies have been discussed.
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Lall, P., Islam, S., Dornala, K., Suhling, J., Shinde, D. (2018). Nano-underfills and Potting Compounds for Fine-Pitch Electronics. In: Morris, J. (eds) Nanopackaging. Springer, Cham. https://doi.org/10.1007/978-3-319-90362-0_16
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DOI: https://doi.org/10.1007/978-3-319-90362-0_16
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