Abstract
As already demonstrated previously, the critical step of the transfer packaging is debonding of the temporary carrier substrate. Mechanical modeling is one of solution for such critical step to understand the exact mechanism governing the failure mode of the transfer packaging. Therefore, this chapter will explain the way how to establish an appropriate FEM model to simulate the debonding process occurring in the interface between Si carrier wafer and transferred cap. The modeling will be useful to comprehend the behavior of the transferred cap in terms of deformation and stress during the debonding process.
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Seok, S. (2018). FEM Modeling of Debonding of Transfer Packaging. In: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering. Springer Series in Advanced Manufacturing. Springer, Cham. https://doi.org/10.1007/978-3-319-77872-3_5
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DOI: https://doi.org/10.1007/978-3-319-77872-3_5
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