Comparison of Highly Mobile Twin Boundaries in Cu–Ni–Al and Ni–Mn–Ga Shape Memory Single Crystals

  • M. Vronka
  • M. Karlík
  • Y. Ge
  • O. Heczko
Conference paper
Part of the The Minerals, Metals & Materials Series book series (MMMS)


We compared twinning systems in Cu–Ni–Al and Ni–Mn–Ga single crystals from macroscale down to atomic scale. Using a newly developed formalism, we studied the twinning stress or mobility and microstructure of the equivalent twin boundaries. In Cu–Ni–Al, compound twinning exhibits the twinning stress of 1–2 MPa, and Type II twinning stress is approximately 20 MPa, which is much higher than the twinning stress for Type II in Ni–Mn–Ga (0.1–0.3 MPa). No temperature dependence was found for twinning stress of Type II in either alloy. Transmission electron microscopy revealed that in contrast to Ni–Mn–Ga, there was no internal twinning in Cu–Ni–Al, only stacking faults. The highest density of stacking faults was observed in the presence of Type I twin boundaries. The extremely low twinning stress may be associated with the deep hierarchy of twinning in Ni–Mn–Ga.


SMA Single crystals Martensite Twinning stress TEM 



This work has been financially supported by the Czech Science Foundation grant No. 14-36566G (AdMat), and furthermore by project LM2015087 of the Czech Ministry of Education, Youth and Sports. M. V. would like to acknowledge financial support by the grant SGS16/249/OHK4/3T/14. M. K. would like to acknowledge financial support of the ERDF in the frame of the project No. CZ.02.1.01/0.0/0.0/15_003/0000485.


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Copyright information

© The Minerals, Metals & Materials Society 2018

Authors and Affiliations

  1. 1.Institute of Physics of the Czech Academy of SciencesPrague 8Czech Republic
  2. 2.Faculty of Nuclear Sciences and Physical Engineering, Department of MaterialsCzech Technical University in PraguePragueCzech Republic
  3. 3.Department of Physics of MaterialsCharles UniversityPrague 2Czech Republic
  4. 4.Department of Materials Science and Engineering, School of Chemical TechnologyAalto UniversityAaltoFinland

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