Abstract
Substrate is the foundation of semiconductor packaging. In this chapter, we will learn about various substrate technologies, structures, and manufacturing design rules. We will also learn about substrate stack-up set-up routing consideration. We will discuss silicon interposer manufacturing process and its application including interposer size, TSV aspect ratios.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2018 Springer International Publishing AG
About this chapter
Cite this chapter
Yazdani, F. (2018). Substrate Physical Implementation. In: Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach. Springer, Cham. https://doi.org/10.1007/978-3-319-75769-8_4
Download citation
DOI: https://doi.org/10.1007/978-3-319-75769-8_4
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-75767-4
Online ISBN: 978-3-319-75769-8
eBook Packages: EngineeringEngineering (R0)