Skip to main content

Designing Hardware for the Boundary Condition Round Robin Challenge

  • Conference paper
  • First Online:
Topics in Modal Analysis & Testing, Volume 9

Abstract

Qualification of products to their vibration and shock requirements in a laboratory setting consists of two basic steps. The first is the quantification of the product’s mechanical environment in the field. The second is the process of testing the product in the laboratory to ensure it is robust enough to survive the field environment. The latter part is the subject of the “Boundary Condition for Component Qualification” challenge problem. This paper describes the challenges in determining the appropriate boundary conditions and input stimulus required to qualify the product. This paper also describes the steps and analyses that were taken to design a set of hardware that demonstrates the issue and can be used by round robin challenge participants to investigate the problem.

The Department of Energy’s Kansas City National Security Campus is operated and managed by Honeywell Federal Manufacturing & Technologies, LLC under contract number DE-NA0002839.

Sandia National Laboratories is a multimission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.

© Copyright Honeywell Federal Manufacturing & Technologies LLC, 2017.

Notice: This manuscript has been authored by Honeywell Federal Manufacturing & Technologies under Contract No.DE-NA-0002839 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a nonexclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Scharton, T.D.: Impedance simulation vibration test fixtures for spacecraft tests. Shock Vibr Bull. 40(3), 230–256 (1969)

    Google Scholar 

  2. Edwards, T.S.: The effects of boundary conditions in component-level shock and vibration testing, publication details unkown (2007)

    Google Scholar 

  3. Daborn, P.M.: Scaling up of the Impedance-Matched Multi-Axis Test (IMMAT) technique. In: Proceedings of the 35th International Modal Analysis Conference, Garden Grove, CA, Feb (2017)

    Google Scholar 

  4. Mayes, R.L.: A modal Craig-Bampton substructure for experiments, analysis, control and specifications. In: Proceedings of the 33rd International Modal Analysis Conference, Orlando, FL, Feb (2015)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to David E. Soine .

Editor information

Editors and Affiliations

Additional information

© Copyright Honeywell Federal Manufacturing & Technologies LLC, 2017

Notice: This manuscript has been authored by Honeywell Federal Manufacturing & Technologies under Contract No.DE-NA-0002839 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a nonexclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes.

Rights and permissions

Reprints and permissions

Copyright information

© 2019 The Society for Experimental Mechanics, Inc.

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Soine, D.E., Jones, R.J., Harvie, J.M., Skousen, T.J., Schoenherr, T.F. (2019). Designing Hardware for the Boundary Condition Round Robin Challenge. In: Mains, M., Dilworth, B. (eds) Topics in Modal Analysis & Testing, Volume 9. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-74700-2_12

Download citation

  • DOI: https://doi.org/10.1007/978-3-319-74700-2_12

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-74699-9

  • Online ISBN: 978-3-319-74700-2

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics