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Integrated Circuit Design and Electromigration

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Fundamentals of Electromigration-Aware Integrated Circuit Design

Abstract

This chapter describes measures for modifying the present integrated circuit design methodology with the objective of countering electromigration. After introducing the overall design flow (Sect. 3.1) in use today, we explore how analog and digital designs are differentiated, as both areas require different measures to counter electromigration (Sect. 3.2). Understanding that knowledge of the currents flowing in interconnects is a fundamental requisite for an electromigration-aware design flow, we discuss in Sect. 3.3 the different types of currents encountered and show how sensible current values can be determined. Section 3.4 describes how robust current-density boundary values can be determined, using application and reliability specifications provided in mission profiles. Effective current-density verification is at the core of electromigration-aware design flows (Sect. 3.5). In Sect. 3.6, we present options for dealing with problems identified by current-density verification, using layout adjustment techniques. In the final Sect. 3.7, we put forward a number of farther-reaching measures for increasing current-density boundary values, based on our assessment of current technological trends.

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Notes

  1. 1.

    Thermal vias are structurally similar to electrical vias, but serve no electrical purpose. Their primary function is to conduct heat vertically through the chip/die and convey it to the heat sink. A thermal wire is used to spread heat in the lateral direction.

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Authors and Affiliations

  1. Electrical and Computer Engineering, Dresden University of Technology, Dresden, Saxony, Germany

    Jens Lienig & Matthias Thiele

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  1. Jens Lienig
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  2. Matthias Thiele
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Correspondence to Jens Lienig .

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Lienig, J., Thiele, M. (2018). Integrated Circuit Design and Electromigration. In: Fundamentals of Electromigration-Aware Integrated Circuit Design. Springer, Cham. https://doi.org/10.1007/978-3-319-73558-0_3

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  • DOI: https://doi.org/10.1007/978-3-319-73558-0_3

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-73557-3

  • Online ISBN: 978-3-319-73558-0

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