Abstract
Concerning nodulation in copper electrorefining , it has been reported that short circuits caused by nodulation have the largest impact on the current efficiency . Therefore, to improve the current efficiency , it is important to prevent nodulation . In this research, the nodulation growth was investigated by replicating nodulation in the laboratory. The experiments were conducted by cathodic electrodeposition on copper plates attached to copper sticks of various heights. The nodulation was analyzed in terms of growth rates versus the initial heights.
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Reference
Dutrizac JE, Chen TT (2013) Proceedings of Copper 99–Cobre 99 international conference III, 383
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© 2018 The Minerals, Metals & Materials Society
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Nakai, Y., Adachi, K., Kitada, A., Fukami, K., Murase, K. (2018). Experimental Modeling of Nodulation in Copper Electrorefining. In: Kim, H., et al. Rare Metal Technology 2018. TMS 2018. The Minerals, Metals & Materials Series. Springer, Cham. https://doi.org/10.1007/978-3-319-72350-1_31
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DOI: https://doi.org/10.1007/978-3-319-72350-1_31
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Publisher Name: Springer, Cham
Print ISBN: 978-3-319-72349-5
Online ISBN: 978-3-319-72350-1
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