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Experimental Modeling of Nodulation in Copper Electrorefining

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Rare Metal Technology 2018 (TMS 2018)

Part of the book series: The Minerals, Metals & Materials Series ((MMMS))

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Abstract

Concerning nodulation in copper electrorefining , it has been reported that short circuits caused by nodulation have the largest impact on the current efficiency . Therefore, to improve the current efficiency , it is important to prevent nodulation . In this research, the nodulation growth was investigated by replicating nodulation in the laboratory. The experiments were conducted by cathodic electrodeposition on copper plates attached to copper sticks of various heights. The nodulation was analyzed in terms of growth rates versus the initial heights.

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Reference

  1. Dutrizac JE, Chen TT (2013) Proceedings of Copper 99–Cobre 99 international conference III, 383

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Kyoto University, Yoshida-Hommachi 36-1, Kyoto, 606-8501, Japan

    Yuya Nakai, Ken Adachi, Atsushi Kitada, Kazuhiro Fukami & Kuniaki Murase

Authors
  1. Yuya Nakai
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  2. Ken Adachi
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  3. Atsushi Kitada
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  4. Kazuhiro Fukami
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  5. Kuniaki Murase
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Corresponding author

Correspondence to Yuya Nakai .

Editor information

Editors and Affiliations

  1. The Pennsylvania State University, University Park, Pennsylvania, USA

    Hojong Kim

  2. Freeport-McMoRan, El Paso, Texas, USA

    Bradford Wesstrom

  3. University of Saskatchewan, Saskatoon, Saskatchewan, Canada

    Shafiq Alam

  4. Massachusetts Institute of Technology, Cambridge, Massachusetts, USA

    Takanari Ouchi

  5. University of Toronto, Toronto, Ontario, Canada

    Gisele Azimi

  6. IND LLC, South Jordan, Utah, USA

    Neale R. Neelameggham

  7. Rio Tinto Kennecott Utah Copper Corp, South Jordan, Utah, USA

    Shijie Wang

  8. Watertown, Massachusetts, USA

    Xiaofei Guan

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© 2018 The Minerals, Metals & Materials Society

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Cite this paper

Nakai, Y., Adachi, K., Kitada, A., Fukami, K., Murase, K. (2018). Experimental Modeling of Nodulation in Copper Electrorefining. In: Kim, H., et al. Rare Metal Technology 2018. TMS 2018. The Minerals, Metals & Materials Series. Springer, Cham. https://doi.org/10.1007/978-3-319-72350-1_31

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