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Experimental Modeling of Nodulation in Copper Electrorefining

  • Yuya NakaiEmail author
  • Ken Adachi
  • Atsushi Kitada
  • Kazuhiro Fukami
  • Kuniaki Murase
Conference paper
Part of the The Minerals, Metals & Materials Series book series (MMMS)

Abstract

Concerning nodulation in copper electrorefining, it has been reported that short circuits caused by nodulation have the largest impact on the current efficiency. Therefore, to improve the current efficiency, it is important to prevent nodulation. In this research, the nodulation growth was investigated by replicating nodulation in the laboratory. The experiments were conducted by cathodic electrodeposition on copper plates attached to copper sticks of various heights. The nodulation was analyzed in terms of growth rates versus the initial heights.

Keywords

Copper Electrorefining Current efficiency Nodulation 

Reference

  1. 1.
    Dutrizac JE, Chen TT (2013) Proceedings of Copper 99–Cobre 99 international conference III, 383Google Scholar

Copyright information

© The Minerals, Metals & Materials Society 2018

Authors and Affiliations

  • Yuya Nakai
    • 1
    Email author
  • Ken Adachi
    • 1
  • Atsushi Kitada
    • 1
  • Kazuhiro Fukami
    • 1
  • Kuniaki Murase
    • 1
  1. 1.Department of Materials Science and EngineeringKyoto UniversityKyotoJapan

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