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FEM Simulation of Nodulation in Copper Electro-refining

  • Ken AdachiEmail author
  • Yuya Nakai
  • Atsushi Kitada
  • Kazuhiro Fukami
  • Kuniaki Murase
Conference paper
Part of the The Minerals, Metals & Materials Series book series (MMMS)

Abstract

In the copper electro-refining process, short circuiting between the cathode and anode caused by nodulation has the largest impact on the loss of current efficiency. In order to improve current efficiency, it is critically important to study the mechanism of the growth of the nodule. In this study, the nodulation was modeled using the finite element method to simulate the growth of copper bumps attached to the cathode. By considering the scale of the electrodes and their pitch, the relationship between the height of the nodule and its growth rate is investigated. In particular, a threshold height of the nodule that determines whether the nodule will rapidly grow to come in contact with the adjacent anode is identified. By comparing the result of the simulation and the experiments, the effect of leveling additives and the generation of dendritic growth are discussed.

Keywords

Copper Electro-refining Nodulation FEM Simulation 

References

  1. 1.
    Ikeda M, Unei A (2015) JOGMEC Reports, 2015, vol 45Google Scholar
  2. 2.
    Davenport W (2011) Extractive metallurgy of copper. Elsevier, New YorkGoogle Scholar
  3. 3.
    Shimokawa K (2013) Studies on the improvement of industrially operated copper electrorefining. Ph.D. thesis, Kyoto UniversityGoogle Scholar
  4. 4.
    Andersen TN, Pitt CH, Livingston LS (1983) J Appl Electrochem 13(4):429–438CrossRefGoogle Scholar

Copyright information

© The Minerals, Metals & Materials Society 2018

Authors and Affiliations

  • Ken Adachi
    • 1
    Email author
  • Yuya Nakai
    • 1
  • Atsushi Kitada
    • 1
  • Kazuhiro Fukami
    • 1
  • Kuniaki Murase
    • 1
  1. 1.Department of Materials Science and EngineeringKyoto UniversityKyotoJapan

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