Direct Bond Copper (DBC) Technologies

Abstract

Direct bond copper technology that primarily uses copper foil bonded directly to ceramic substrates was originally developed and patented by General Electric Company in the early 1970s and subsequently protected with a series of other patents. The standard direct bond copper or DBC technology which uses copper foil thicknesses in the range of 0.005–0.020 in. is usually specified for high-power and high thermal management circuits where the large geometry requirements of 0.015-in.-wide lines and spacings can be used. New processes and additional refinements of the process which adapt the inherent advantages of the strong bonding mechanism of the DBC process, however, will allow the technology to be adapted for fine-line circuitry and will extend its applications to high-frequency circuits.