Conventional Test Methods

  • Selahattin Sayil


With shrinking sizes of devices and increasing chip densities, circuits have become so fast, compact, and inaccessible that the use of conventional methods based on mechanical probe has become limited and inadequate. The conventional test methods or the mechanical probe techniques used for functional and internal fault testing face increasingly difficult challenges. This chapter discusses these limitations of conventional methods and highlights the importance of alternative probing solutions to address the upcoming challenges.


VLSI testing Mechanical probe Conventional methods 


  1. 1.
    N. Weste, D. Harris, Principles of CMOS VLSI Design – A Circuits and Systems Perspective, 4th edn. (Addison-Wesley, Reading, 2010)Google Scholar
  2. 2.
    Semiconductor Industry Association (SIA), International Technology Roadmap for Semiconductors, 2011 Edition (Semiconductor Industry Association (SIA), San Jose, 2011)Google Scholar
  3. 3.
    H.-H.S. Lee, K. Chakrabarty, Test challenges for 3D integrated circuits. IEEE Des. Test Comput. 26(5), 26–35 (2009)CrossRefGoogle Scholar
  4. 4.
    W.R. Mann et al., The leading edge of production wafer probe test technology, in Proceedings of International Test Conference, Charlotte, October 2004, pp. 1168–1195Google Scholar
  5. 5.
    B.S. Landman, R.L. Russo, On a pin versus block relationship for partitions of logic graphs. IEEE Trans. Comput. c-20(12), 1469–1479 (1971)CrossRefGoogle Scholar
  6. 6.
    H.B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI (Addison Wesley, Reading, 1990)Google Scholar

Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  • Selahattin Sayil
    • 1
  1. 1.Lamar UniversityBeaumontUSA

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