Abstract
An antenna-in-package solution has recently been the ultimate technology offering innovation and perhaps the most highly integrated radio miniaturization surface-mounted chipset device for short-range, high-speed, high-gain, and large-scale big data hyper-performance server platforms. Electromagnetic interference (EMI) arises as a result of discontinuity of the interconnections between the antenna and the integrated circuit (IC) chips, which limits their efficiency considerably, as it increases the mutual coupling and initiates and propagates surface waves, thus limiting the radiation efficiency in particular at the far-field. The backplanes, on which the IC boards containing data communication chips and processors are densely installed, are interconnected with high-speed integrated transceiver circuits using wire traces and connectors. As a result, transmission losses become considerable, in particular for backplanes operating at transfer speeds greater than 10 Gbps. In effect, the signal distortion becomes so significant that accurate data transmission without distortion is near impossible. Techniques to ameliorate the drawbacks of the side effects of parasitics are investigated in this chapter. Existing solutions to mitigate such effects are assessed to determine the extent of their efficacy. Alternative coupling techniques are examined. The effects of grounding, filtering, guard rings, shielding and decoupling are studied. The implication of process technology in eliminating EMI is also examined.
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Olokede, S.S., Paul, B.S. (2018). Electromagnetic Interference and Discontinuity Effects of Interconnections on Big Data Performance of Integrated Circuits. In: Skourletopoulos, G., Mastorakis, G., Mavromoustakis, C., Dobre, C., Pallis, E. (eds) Mobile Big Data. Lecture Notes on Data Engineering and Communications Technologies, vol 10. Springer, Cham. https://doi.org/10.1007/978-3-319-67925-9_8
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