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Pulsed Magnetron Sputtering: The Role of the Applied Power on W Coatings Properties

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Recent Advances in Technology Research and Education (INTER-ACADEMIA 2017)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 660))

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Abstract

The interaction of low/high density transient plasma with tungsten (W) target was investigated via the sputtered material: in the gas phase, measuring the ion energy distribution function, and as deposited coatings, analyzing the compositional, structural, morphological, mechanical and tribological properties. The W target was sputtered in Ar atmosphere, at two different target power densities (instantaneous peak values of 0.2 and 3 kW/cm2), using a pulsed magnetron discharge. All obtained coatings were polycrystalline. A porous columnar structure was observed for the films deposited at low target power density, while denser-than-bulk films were obtained at high target power density. Comparing the high and low power modes, the W+ ion flux is seven times higher in the first case, while the deposition rate is three times higher in the second one.

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Acknowledgment

This work has been carried out within the framework of the EUROfusion Consortium and has received funding from the Euratom research and training programme 2014–2018 under grant agreement No 633053. The views and opinions expressed herein do not necessarily reflect those of the European Commission. The project has also received funding from the Romanian National Education Minister/Institute of Atomic Physics under contract 1EU-1/2/2016.

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Correspondence to Ioana-Laura Velicu .

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Velicu, IL., Tiron, V., Mihaila, I., Costin, C. (2018). Pulsed Magnetron Sputtering: The Role of the Applied Power on W Coatings Properties. In: Luca, D., Sirghi, L., Costin, C. (eds) Recent Advances in Technology Research and Education. INTER-ACADEMIA 2017. Advances in Intelligent Systems and Computing, vol 660. Springer, Cham. https://doi.org/10.1007/978-3-319-67459-9_24

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  • DOI: https://doi.org/10.1007/978-3-319-67459-9_24

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  • Publisher Name: Springer, Cham

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  • Online ISBN: 978-3-319-67459-9

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