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Smart Features Integrated for Prognostics Health Management Assure the Functional Safety of the Electronics Systems at the High Level Required in Fully Automated Vehicles

  • Sven RzepkaEmail author
  • Przemyslaw J. Gromala
Conference paper
Part of the Lecture Notes in Mobility book series (LNMOB)

Abstract

The current developments in automotive industry toward automated driving require a massive increase in functionality, number, and complexity of the electronic systems. At the same time, the functional safety of those electronic systems must be improved beyond the high requirements applied today already. Designing the systems for a guaranteed lifetime on statistical average will no longer suffice. Therefore, new methods in the design and reliability assessment toward maintainable or replaceable systems are required. Prognostics and health management (PHM) provides the way for this upgrade in reliability methodology. The paper introduces a multi-level PHM strategy based on smart sensors and detectors integrated into the functional electronic units so that maintenance can be triggered if needed yet always well before the actual failure occurs in the individual system.

Keywords

PHM Health monitoring Reliability Functional safety Automotive electronics Automated driving Smart sensors 

Notes

Acknowledgements

The authors would like to thank the PHM team of EuWoRel 2016 for the fruitful discussion on the PHM metro map. In particular, we thank the track owners: D. Vanderstraeten (OnSemiconductor), J. Arwidson (Saab), E. Tsiporkova (Sirris), S. Kunath (Dynardo). We are looking forward to the work in ‘smartSTAR’, the PENTA project supported by BMBF (Germany) and VLAIO (Belgium).

References

  1. Chauhan P, Mathew S, Osterman M, Pecht M (2014) In situ interconnect failure prediction using canaries. IEEE Trans Device Mater Reliab 14(3):826–832CrossRefGoogle Scholar
  2. Frühauf P, Gromala P, Rzepka S, Wilke K (2016) Electronic component comprising a plurality of contact structures and method for monitoring contact structures of an electronic component. Patent application EP3086132A1Google Scholar
  3. Gromala P, Palczynska A, Han B (2015) Prognostic approaches for the wirebond failure prediction in power semiconductors: a case study using DPAK package. In: 16th international conference on electronic packaging technology, ICEPT. pp 413–8Google Scholar
  4. Lall P, Islam MN, Rahim MK, Suhling JC (2006) Prognostics and health management of electronic packaging. IEEE Trans CPMT 29(3):666–677Google Scholar
  5. Lall P, Lowe R, Goebel K (2012) Cost assessment for implementation of embedded prognostic health management for electronic systems; ASME 2012. In: international mechanical engineering congress and exposition, IMECE 2012, vol 9. pp 775–85 (Issue Parts A and B). doi: 10.1115/IMECE2012-93058
  6. Lall P, Lowe R, Goebel K (2013) Comparison of prognostic health management algorithms for assessment of electronic interconnect reliability; ASME 2013. In: Proceedings of International technical conference and exhibition on packaging and integration of electronic and photonic microsystems, InterPACK 2013, vol 1. doi: 10.1115/IPACK2013-73252
  7. Palczynska A, Prisacaru A, Gromala P, Han B, Mayer D, Melz T (2016). Towards prognostics and health monitoring: the potential of fault detection by piezoresistive silicon stress sensor. In: 17th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, montpellier. doi: 10.1109/EuroSimE.2016.7463344
  8. Prisacaru A, Palczynska A, Gromala P, Han B, Zhang GQ (2017) Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units. In: 67th IEEE electronic components and technology conference. OrlandoGoogle Scholar
  9. Schindler-Saefkow F, Rost F, Faust W, Wunderle B, Michel B, Rzepka S (2012) Stress chip measurements of the internal package stress for process characterization and health monitoring. In: 13th International conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems. Cascais, Portugal. doi: 10.1109/ESimE.2012.6191746
  10. Vichare N, Rodgers P, Eveloy V, Pecht MG (2004) In situ temperature measurement of a notebook computer—a case study in health and usage monitoring of electronics. IEEE Trans Device Mater Reliab 4(4):3–658CrossRefGoogle Scholar
  11. Wang Y, Miao Q, Pecht M (2011) Health monitoring of hard disk drive based on Mahalanobis distance. In: Proceedings of prognostics and system health management conference, vol 1. Shenzhen, pp 1–8Google Scholar

Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.Micro Materials CenterFraunhofer Institute for Electronic Nano Systems (ENAS)ChemnitzGermany
  2. 2.(AE/EDT3)Robert Bosch GmbHReutlingenGermany

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