Abstract
Currently, Additive Manufacturing (AM) is limited to three classes of materials: ceramics, polymers and metals. Even within these classes, only a small number of materials can be processed by AM, either in a powder bed approach or in a direct energy deposition approach.
We propose to extend AM to a new class of materials: semiconductors. We process silicon powders by direct laser melting (DLM), and we present the experimental setup in details.
AM in general and more precisely DLM of brittle materials is challenging due to thermal stresses and cracks that build up during the process. In this contribution, we demonstrate the possibility of attaching Si pillars built by DLM to a monocrystalline wafer by increasing the pre-heating temperature of the substrate thanks to a hot plate.
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Acknowledgments
The authors would like to thank Bernhard von Gunten, Christoph Amsler and Mehari Asfaha for the technical support on building and improving the process chamber. We would also like to thank Renato Figi and Melanie Bürki for the combustion and infrared analysis measurements.
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Le Dantec, M., Abdulstaar, M., Leistner, M., Leparoux, M., Hoffmann, P. (2018). Additive Manufacturing of Semiconductor Silicon on Silicon Using Direct Laser Melting. In: Meboldt, M., Klahn, C. (eds) Industrializing Additive Manufacturing - Proceedings of Additive Manufacturing in Products and Applications - AMPA2017. AMPA 2017. Springer, Cham. https://doi.org/10.1007/978-3-319-66866-6_10
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DOI: https://doi.org/10.1007/978-3-319-66866-6_10
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