Abstract
In this paper, we propose a method to inspect wheel mark defect on the wafer backside. The aim of this method is to detect wheel mark defects through back side film and back grinding tape on back side of the wafer. To reduce noise from both films, we used a vignetting correction to eliminate vignetting effects from line scan and Gaussian smoothing filter to reduce noises from back side films. Then, we used a Circle Curve Fitting to find the center point of the wafer and extracted the periodic feature in polar coordinates using the Fourier transform. And we also measured the noise signal on the background to calculate SNR and parameterize it. A sample test result shows that the proposed method is effective to control the quality of products in the factory.
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Park, Y., Kang, K., Kim, S. (2017). A Visual Inspection Method Based on Periodic Feature for Wheel Mark Defect on Wafer Backside. In: Felsberg, M., Heyden, A., Krüger, N. (eds) Computer Analysis of Images and Patterns. CAIP 2017. Lecture Notes in Computer Science(), vol 10424. Springer, Cham. https://doi.org/10.1007/978-3-319-64689-3_18
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DOI: https://doi.org/10.1007/978-3-319-64689-3_18
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