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Application of AlN-Coated Heat Sink to Improve the Thermal Management of Light-Emitting Diode Assembles

  • Guo-Fu Lian
  • Ming-Der JeanEmail author
  • Tzu-Hsuan Chien
Conference paper
Part of the Smart Innovation, Systems and Technologies book series (SIST, volume 82)

Abstract

This study reports the use of aluminum nitride(AlN) ceramics as a heat dissipated interface material to enhance the thermal performance of light-emitting diode (LED) packages. AlN ceramics are coated on copper/aluminum substrates by electrostatic spraying. The 18 orthogonal arrays of the LEDs with a signal-to-noise ratio are adopted and the impact of the effect of the spraying parameters on the AlN coatings is examined. Using an optimized design, the thermal performance of the LED is improved and good heat resistance characteristics are achieved. A confirmation run is used to compare results with the overall experimental tests. The results show that using AlN ceramic coating on a heat sink yields a good the thermal performance.

Keywords

Aluminum nitride Thermal performance Optimization Light-emitting diode 

Notes

Acknowledgments

This research was financially supported by the Natural Science Foundation of Fujian Province (grant number 2015J01181)

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Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.School of Mechanical and Automotive EngineeringFujian University of TechnologyFuzhouChina
  2. 2.Department of Medical Laboratory Science and BiotechnologyKaohsiung Medical UniversityKaohsiungTaiwan

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