Hybrid Nanomaterials for Flexible Electronics Interconnects

Abstract

In emerging flexible electronics survivable to high strain-rate deformation (high impact environment), interconnects materials are to exhibit high strain to failure characteristics while maintaining the desired electrical, and in high power applications thermal properties as well. In this work we present a novel nano materials possessing high strain to failure properties with desired electrical and thermal characteristics. A junctioned interconnected network of nano materials (carbon nanofibers, in our case) is embedded in highly flexible polymers. Atomistic scale simulation reveals that design of network junctions critically influence the electrical and thermal properties, whereas the flexibility in the network provides the strain resiliency. The network contact electrical conductance is influenced by the overlapping electronic orbitals of the adjacent (joining nano elements) at the junction, whereas, the junction thermal conductance depends on the matching of the atomic mass and atomic interaction potentials of the junction materials composition. To facilitate welding of the junctions of the nano elements, junctions with metallic nano particles (Ti, Cr, Au, Ag) have also been studied. On processing of such junctioned hybrid network of carbon nanofibers in flexible polymers, bio-inspired Peptide assisted Au nanoparticle dispersion on carbon nanofibers is being pursued to create metallic nano junctions. In addition, characteristics for direct printing (additive manufacturing) of the material is demonstrated. Both the computational and supporting experimental work will be presented to discuss the potential of this novel hybrid nano material concept for high flexibility and strain resiliency as a viable interconnect materials for flexible electronics.