Abstract
In this research, material time-dependent behavior of Sn3.5Ag, Sn37Pb and Sn5Sb solder alloys were studied by a depth sensing micro-indentation method at room temperature. Stress exponent values were determined through a constant loading process utilizing a spherical micro indentation method, where the strain rate is extracted from the indentation rate. The measured stress exponent values are in good agreement with conventional creep experiments. Utilizing a multiple loading and partial unloading micro-indentation testing procedure, time-dependent stiffness changes of these materials could be measured. This continuous stiffness responses during a creep test can be correlated to test material’s microstructural changes during creep, therefore making it capable to predict onset of tertiary creep failure. Test results show a correlation between measured continuous stiffness response and creep damage with the capability to predict the onset of tertiary stage.
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© 2018 The Society for Experimental Mechanics, Inc.
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Otunyo, D.C., Kang, B.S. (2018). Material Creep Behavior with Prediction of Tertiary Creep Failure by a Spherical Micro-indentation Method. In: Arzoumanidis, A., Silberstein, M., Amirkhizi, A. (eds) Challenges in Mechanics of Time Dependent Materials, Volume 2. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-63393-0_8
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DOI: https://doi.org/10.1007/978-3-319-63393-0_8
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