Abstract
As seen in Chap. 2, gain-cell (GC) embedded DRAM (eDRAM), or GC-eDRAM in short, is an interesting alternative to static random-access memory (SRAM) and 1-transistor-1-capacitor (1T-1C) eDRAM for reasons, such as high storage density, low bitcell leakage, logic compatibility, and suitability for two-port memories. The major drawbacks of GC-eDRAMs are their limited data retention times (RTs) and the large spread of RT across an array (Chun et al., IEEE J Solid State Circuits 47(10):2517–2526, 2012; Meinerzhagen et al., IET J Eng 1, 2013), which limit energy-efficiency due to refresh cycles. While the array refresh rate can be determined by circuit simulations or post-silicon measurements, there is a lack of analytical and statistical GC-eDRAM RT models unveiling the circuit parameters, which lead to the large observed RT spreads. This chapter derives a comprehensive analytical model for the nominal value, as well as the statistical distribution of the per-cell retention time of 2-transistor (2T)-bitcell GC-eDRAMs, which is found to follow a log-normal distribution. The accuracy of the proposed retention time model is verified by extensive Monte Carlo (MC) and worst-case distance circuit simulations, as well as silicon measurements of an 0.18 µm test chip. Furthermore, a sensitivity analysis unveils the circuit parameters that have the highest impact on the RT spread. Interestingly, the variability of the threshold voltage of the write transistor (MW) has a much higher impact on the RT spread than the variability of any other circuit parameter, including the storage node (SN) capacitor. The insights gained from the retention time model help circuit designers achieve longer RTs and sharper RT distributions, which are key enablers for low-power GC-eDRAM designs. To summarize the learnings from this chapter, best-practice 2T GC design guidelines are presented.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Notes
- 1.
This holds true for the applicable range of V SN(t 0) < V SN < V EDRT.
References
Burmaster DE, Hull DA (1997) Using lognormal distributions and lognormal probability plots in probabilistic risk assessments. Hum Ecol Risk Assess 3(2):235–255
Butzen PF, Ribas RP (2006) Leakage current in sub-micrometer CMOS gates. Universidade Federal do Rio Grande do Sul, pp 1–28
Chang MT, Rosenfeld P, Lu SL, Jacob B (2013) Technology comparison for large last-level caches (L3Cs): low-leakage SRAM, low write-energy STT-RAM, and refresh-optimized eDRAM. In: IEEE International symposium on high performance computer architecture (HPCA), pp 143–154
Cheng Y, Chan M, Hui K, Jeng Mc, Liu Z, Huang J, Chen K, Chen J, Tu R, Ko PK, et al (1996) BSIM3v3 manual. University of California, Berkeley
Chun KC, Jain P, Lee JH, Kim C (2011) A 3T gain cell embedded DRAM utilizing preferential boosting for high density and low power on-die caches. IEEE J Solid State Circuits 46(6):1495–1505
Chun KC, Jain P, Kim TH, Kim C (2012) A 667 MHz logic-compatible embedded DRAM featuring an asymmetric 2T gain cell for high speed on-die caches. IEEE J Solid State Circuits 47(2):547–559. doi:10.1109/JSSC.2011.2168729
Chun KC, Zhang W, Jain P, Kim C (2012) A 2T1C embedded DRAM macro with no boosted supplies featuring a 7T SRAM based repair and a cell storage monitor. IEEE J Solid State Circuits 47(10):2517–2526
Do AT, Yi H, Yeo KS, Kim T (2012) Retention time characterization and optimization of logic-compatible embedded DRAM cells. In: Proceedings of the IEEE Asia symposium on quality electronic design (ASQED), pp 29–34
Ghosh S (2014) Modeling of retention time for high-speed embedded dynamic random access memories. IEEE Trans Circuits Syst I 61(9):2596–2604
Giterman R, Teman A, Meinerzhagen P, Atias L, Burg A, Fish A (2016) Single-supply 3T gain-cell for low-voltage low-power applications. IEEE Trans Very Large Scale Integr (VLSI) Syst 24(1):358–362
Karakonstantis G, Roth C, Benkeser C, Burg A (2012) On the exploitation of the inherent error resilience of wireless systems under unreliable silicon. In: Proceedings of the ACM/EDAC/IEEE design automation conference (DAC), pp 510–515
Lin DK, Draper NR (1993) Generating alias relationships for two-level Plackett and Burman designs. Comput Stat Data Anal 15(2):147–157
Mande S, Chandorkar AN, Hsaio C, Huang K, Sheu YM, Liu S (2009) A novel approach to link process parameters to BSIM model parameters. IEEE Trans Semicond Manuf 22(4):544–551
Mande SS, Chandorkar AN, Iwai H (2013) Computationally efficient methodology for statistical characterization and yield estimation due to inter-and intra-die process variations. In: Proceedings of the IEEE Asia symposium on quality electronic design (ASQED), pp 287–294
Meinerzhagen P, Teman A, Mordakhay A, Burg A, Fish A (2012) A sub-VT 2T gain-cell memory for biomedical applications. In: Proceedings of the IEEE subthreshold microelectronics conference (SubVT), pp 1–3. doi:10.1109/SubVT.2012.6404318
Meinerzhagen P, Teman A, Burg A, Fish A (2013) Impact of body biasing on the retention time of gain-cell memories. IET J Eng 1:1–4
Meinerzhagen P, Teman A, Giterman R, Burg A, Fish A (2013) Exploration of sub-VT and near-VT 2T gain-cell memories for ultra-low power applications under technology scaling. J Low Power Electron Appl 3(2):54–72. doi:10.3390/jlpea3020054
Mokhov A, Rykunov M, Sokolov D, Yakovlev A (2014) Design of processors with reconfigurable microarchitecture. J Low Power Electron Appl 4(1):26–43
Park YS, Blaauw D, Sylvester D, Zhang Z (2012) A 1.6-mm2 38-mW 1.5-Gb/s LDPC decoder enabled by refresh-free embedded DRAM. In: Proceedings of the IEEE symposium on VLSI circuits (VLSIC), pp 114–115
Shauly EN (2012) CMOS leakage and power reduction in transistors and circuits: process and layout considerations. J Low Power Electron Appl 2(1):1–29
Somasekhar D, Ye Y, Aseron P, Lu SL, Khellah M, Howard J, Ruhl G, Karnik T, Borkar S, De V, Keshavarzi A (2009) 2 GHz 2 Mb 2T gain cell memory macro with 128 GBytes/sec bandwidth in a 65 nm logic process technology. IEEE J Solid State Circuits 44(1):174–185
Teman A, Meinerzhagen P, Burg A, Fish A (2012) Review and classification of gain cell eDRAM implementations. In: Proceedings of the IEEE convention of electrical and electronics engineers in Israel (IEEEI), pp 1–5
Teman A, Meinerzhagen P, Giterman R, Fish A, Burg A (2014) Replica technique for adaptive refresh timing of gain-cell embedded DRAM. IEEE Trans Circuits Syst II 61(4):259–263
Teman A, Karakonstantis G, Giterman R, Meinerzhagen P, Burg A (2015) Energy versus data integrity trade-offs in embedded high-density logic compatible dynamic memories. In: Proceedings of the ACM design, automation & test in Europe conference & exhibition (DATE), DATE ’15, pp 489–494
Wilkerson C, Alameldeen AR, Chishti Z, Wu W, Somasekhar D, Lu Sl (2010) Reducing cache power with low-cost, multi-bit error-correcting codes. ACM SIGARCH Comput Architect News 38(3):83–93
Xie YF, Cheng K, Lin YY (2012) A logic 2T gain cell eDRAM with enhanced retention and fast write scheme. In: Proceedings of the IEEE international conference on solid-state and integrated circuit technology (ICSICT), pp 1–3
Zhang W, Chun KC, Kim CH (2010) Variation aware performance analysis of gain cell embedded DRAMs. In: Proceedings of the ACM/IEEE international symposium on low power electronics and design (ISLPED), pp 19–24
Zhang X, Leomant S, Lau KL, Bermak A (2011) A compact digital pixel sensor (DPS) using 2T-DRAM. J Low Power Electron Appl 1(1):77–96
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2018 Springer International Publishing AG
About this chapter
Cite this chapter
Meinerzhagen, P., Teman, A., Giterman, R., Edri, N., Burg, A., Fish, A. (2018). Retention Time Modeling: The Key to Low-Power GC-eDRAMs. In: Gain-Cell Embedded DRAMs for Low-Power VLSI Systems-on-Chip. Springer, Cham. https://doi.org/10.1007/978-3-319-60402-2_3
Download citation
DOI: https://doi.org/10.1007/978-3-319-60402-2_3
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-60401-5
Online ISBN: 978-3-319-60402-2
eBook Packages: EngineeringEngineering (R0)